XC5VLX30T-1FF665C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 360 1327104 30720 665-BBGA, FCBGA |
|---|---|
| Quantity | 598 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC5VLX30T-1FF665C – Virtex®-5 LXT Field Programmable Gate Array (FPGA)
The XC5VLX30T-1FF665C is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC from AMD. It provides a balance of programmable logic, on-chip memory and I/O capacity in a high-pin-count FCBGA package.
This device includes 30,720 logic elements, approximately 1.327 Mbits of embedded memory, and 360 I/O pins, and is offered in a 665-FCBGA (27×27) surface-mount package. The part operates from a 0.95 V–1.05 V supply and is rated for commercial temperature operation (0 °C–85 °C). It is RoHS compliant.
Key Features
- Core Logic 30,720 logic elements for implementing complex programmable logic designs and combinational/sequential logic functions.
- Embedded Memory Approximately 1.327 Mbits of on-chip RAM (1,327,104 bits) for data buffering, state storage and local memory needs.
- I/O Capacity 360 I/O pins to support extensive external interfacing and multi-channel connectivity requirements.
- Package & Mounting 665-BBGA / 665-FCBGA (27×27) package in a surface-mount form factor for dense board-level integration.
- Power Core voltage supply range of 0.95 V–1.05 V to match low-voltage digital system power rails.
- Temperature & Grade Commercial grade device rated for 0 °C–85 °C operation.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-density digital processing Use where 30,720 logic elements and on-chip memory (≈1.327 Mbits) are required to implement complex logic functions and local buffering.
- I/O-intensive interface control With 360 I/O, suitable for designs that require many external connections, parallel interfaces or multiple peripheral channels.
- Commercial product development and prototyping The commercial temperature range, surface-mount 665-FCBGA package and RoHS compliance make this device appropriate for commercial electronic systems and development platforms.
Unique Advantages
- Highly integrated logic and memory: Combines 30,720 logic elements with approximately 1.327 Mbits of embedded RAM to reduce the need for external logic and memory components.
- Extensive external connectivity: 360 I/O pins enable broad interfacing options for multi-channel and parallel systems.
- Compact, high-pin-count package: 665-FCBGA (27×27) supports dense PCB layouts while providing high I/O and signal routing capability.
- Low-voltage core operation: 0.95 V–1.05 V supply range aligns with modern low-voltage digital power architectures.
- Commercial temperature and RoHS compliance: Rated for 0 °C–85 °C and RoHS compliant for commercial product requirements.
Why Choose XC5VLX30T-1FF665C?
The XC5VLX30T-1FF665C positions a Virtex®-5 LXT FPGA’s logic density, embedded memory and I/O capacity within a compact 665-FCBGA surface-mount package. Its combination of 30,720 logic elements, ≈1.327 Mbits of on-chip RAM and 360 I/O pins provides a practical balance of resources for mid-range programmable logic designs that require significant logic and interfacing capability.
Manufactured by AMD and offered as a commercial-grade, RoHS-compliant device, the XC5VLX30T-1FF665C is suitable for development teams and procurement of commercial electronic systems that need predictable operating temperature range, low-voltage core operation and a high level of integration.
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