XC5VLX30-3FFG676C

The XC5VLX30-3FFG676C is a Virtex®-5 LX field programmable gate array (FPGA) in a 676-ball FCBGA package from AMD. It combines substantial programmable logic and embedded memory with a high I/O count and a compact surface-mount package for commercial-grade board-level integration.

Key electrical and environmental parameters include a supply voltage range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C, with RoHS compliance for regulatory compatibility.

Key Features

• Logic Capacity — 30,720 logic elements implemented as 2,400 configurable logic blocks (CLBs), enabling implementation of complex custom digital functions.
• Embedded Memory — Approximately 1.18 Mbits of on-chip RAM for buffering, on-chip storage, and local data processing.
• I/O Density — 400 user I/O pins to interface with peripherals, sensors, and external memory or logic devices.
• Power — Core supply voltage specified between 0.95 V and 1.05 V to match system power rails and design constraints.
• Package — 676‑ball FCBGA (676‑BBGA) supplier device package, 27×27 mm, surface-mount mounting for compact board designs.
• Commercial Grade — Rated for operation from 0 °C to 85 °C for commercial temperature applications.
• Regulatory — RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Custom digital logic and prototyping — Use the 30,720 logic elements to implement custom accelerators, protocol bridges, and prototype architectures.
• Memory-buffered processing — Approximately 1.18 Mbits of embedded RAM supports local buffering and intermediate data storage in FPGA designs.
• High‑pin-count interfacing — 400 I/O pins enable integration with multiple peripherals, sensors, or external devices in compact systems.
• Compact board‑level integration — 676‑ball FCBGA surface-mount package (27×27 mm) allows dense placement on PCBs where board space is constrained.

Unique Advantages

• Substantial logic resources: 30,720 logic elements provide capacity for sizable custom logic implementations without immediate upscaling.
• On-chip memory: Approximately 1.18 Mbits of embedded RAM reduces reliance on external memory for many buffering and streaming use cases.
• High I/O count: 400 user I/Os simplify direct interfacing to multiple external components and mixed-signal front ends.
• Space-efficient package: 676‑FBGA (27×27 mm), surface-mount packaging supports compact PCB designs and modern assembly processes.
• Commercial operating range: 0 °C to 85 °C suits a wide range of commercial applications and environments.
• RoHS compliant: Facilitates lead-free manufacturing and compliance with common environmental requirements.

Why Choose XC5VLX30-3FFG676C?

The XC5VLX30-3FFG676C positions itself as a capable, commercially graded FPGA option for designers needing a balance of logic capacity, embedded memory, and high I/O in a compact ball-grid package. Its combination of 30,720 logic elements, approximately 1.18 Mbits of on-chip RAM, and 400 I/Os makes it suitable for designs that require substantial programmable resources while maintaining a small PCB footprint.

Choose this device when you require a RoHS-compliant, surface-mount FPGA with defined supply and temperature ranges (0.95–1.05 V, 0 °C to 85 °C) and a 676‑ball FCBGA package for board-level integration.

Request a quote or submit a purchase inquiry today to get pricing and availability for the XC5VLX30-3FFG676C.