XC5VLX30-3FFG324C

The XC5VLX30-3FFG324C is a commercial-grade Virtex®-5 LX field programmable gate array (FPGA) offered in a 324-ball FCBGA package. It delivers a combination of high logic capacity, substantial on-chip memory, and broad I/O connectivity for commercial reconfigurable designs.

With 30,720 logic elements, approximately 1.18 Mbits of embedded RAM, and up to 220 I/O, this device is suited for commercial applications that require dense logic implementation and flexible interfacing in a compact surface-mount form factor.

Key Features

• Core Logic  30,720 logic elements provide significant configurable logic capacity for complex custom functions and data-path implementations.
• Configurable Logic Blocks (CLBs)  Approximately 2,400 CLBs for structured logic partitioning and modular design.
• Embedded Memory  Approximately 1.18 Mbits of on-chip RAM supports buffering, FIFOs, and distributed memory needs without external devices.
• I/O Density  Up to 220 I/O pins enable broad peripheral connectivity and high-pin-count system integration.
• Power  Core supply operation specified between 0.95 V and 1.05 V to match system power-rail planning and low-voltage designs.
• Package & Mounting  324-ball FCBGA (324-BBGA) package, supplier package 324-FCBGA (19×19), optimized for surface-mount PCB assembly and compact board layouts.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C for typical commercial-environment deployments.
• Regulatory  RoHS compliant for environmental and regulatory conformity in commercial products.

Typical Applications

• Commercial communications equipment  Implement protocol processing, packet handling, and custom bridging functions using the device’s logic density and on-chip RAM.
• High-density I/O subsystems  Drive multi-interface boards and custom peripheral clusters with up to 220 general-purpose I/O pins.
• Embedded system prototyping  Rapidly iterate hardware algorithms and custom accelerators leveraging a large pool of logic elements and memory resources.
• Custom hardware acceleration  Offload compute-intensive tasks to reconfigurable logic to tailor performance and functionality for commercial applications.

Unique Advantages

• High logic capacity: 30,720 logic elements allow implementation of complex, multi-function designs on a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 1.18 Mbits of on-chip RAM minimizes the need for external memory in many buffering and state-storage use cases.
• Wide I/O complement: Up to 220 I/O pins provide flexibility for interfacing to a variety of peripherals and external devices.
• Compact packaging: 324-FCBGA (19×19) package enables high-density mounting and compact PCB layouts while preserving routing capability.
• Commercial-grade readiness: Specified 0 °C to 85 °C operation and RoHS compliance make it appropriate for mainstream commercial deployments.
• Low-voltage core: Core supply range of 0.95 V to 1.05 V supports low-voltage system architectures and power budgeting.

Why Choose XC5VLX30-3FFG324C?

The XC5VLX30-3FFG324C positions itself as a capable commercial FPGA option where substantial logic density, embedded memory, and flexible I/O are required in a compact surface-mount package. Its combination of 30,720 logic elements, approximately 1.18 Mbits of RAM, and 220 I/O pins provides designers with the resources to consolidate functions and reduce external component count.

Choose this device for commercial designs that need scalable logic resources, substantial on-chip storage, and a 324-FCBGA footprint for space-constrained PCBs. The part’s electrical and mechanical specifications support reliable integration into mainstream commercial products.

Request a quote or submit a purchase inquiry today to evaluate how XC5VLX30-3FFG324C fits your next commercial FPGA design.