XC5VLX30-3FF324C

The XC5VLX30-3FF324C is a Virtex®-5 LX field programmable gate array (FPGA) supplied in a 324-ball FCBGA package. It provides 30,720 logic elements and approximately 1.18 Mbits of embedded memory, along with 220 user I/O connections, making it suitable for moderate-density programmable logic applications.

This surface-mount, commercial-grade device operates from a 0.95 V to 1.05 V core supply and across an ambient temperature range of 0 °C to 85 °C. It is RoHS compliant for regulatory compatibility.

Key Features

• Core and Logic  30,720 logic elements to implement custom digital functions and combinational/sequential logic.
• Embedded Memory  Approximately 1.18 Mbits of on-chip RAM to support buffers, FIFOs, and distributed memory structures.
• I/O Density  220 user I/O pins to interface with peripherals, external memory, and system buses.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match system power architectures.
• Package and Mounting  324-BBGA FCBGA (324-FCBGA, 19×19) package designed for surface-mount assembly.
• Operating Range & Compliance  Commercial-grade operation from 0 °C to 85 °C and RoHS compliance for environmental standards.

Typical Applications

• FPGA-Based System Prototyping  Use the device to prototype and validate custom digital logic with up to 30,720 logic elements and on-chip RAM.
• Custom Logic and Glue Logic  Implement interface bridging, protocol conversion, and control logic using abundant I/O and embedded memory.
• Embedded Processing Acceleration  Offload compute kernels or hardware accelerators that benefit from reconfigurable logic and local RAM.
• High-Channel I/O Designs  Leverage 220 user I/Os for designs requiring multiple parallel interfaces or discrete signaling lines.

Unique Advantages

• Substantial Logic Capacity: 30,720 logic elements allow integration of sizeable custom logic blocks within a single device, reducing the need for multiple chips.
• Integrated On-Chip Memory: Approximately 1.18 Mbits of embedded RAM supports buffering and local data storage without external memory.
• Generous I/O Count: 220 user I/Os provide flexibility for complex interfacing and multiple peripheral connections.
• Compact Surface-Mount Package: 324-FCBGA (19×19) packaging delivers a high pin-count solution in a compact form factor for space-constrained PCBs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match commercial electronics environments.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC5VLX30-3FF324C?

The XC5VLX30-3FF324C combines a substantial logic fabric, significant on-chip memory, and a high I/O count in a 324-ball FCBGA surface-mount package. This balance of resources and packaging density makes it well-suited for designers seeking a programmable logic device capable of consolidating moderate-complexity digital functions and interfaces into a single FPGA.

Its defined supply voltage range and commercial temperature grading, together with RoHS compliance, provide a clear specification set for procurement and system integration. The device is appropriate for development teams and OEMs targeting flexible, reconfigurable hardware implementations where on-chip RAM and I/O capacity are key considerations.

Request a quote or submit an inquiry to begin procurement and receive pricing and availability for the XC5VLX30-3FF324C.