XC5VLX30-2FF676I

The XC5VLX30-2FF676I is a Virtex®-5 LX field programmable gate array from AMD, supplied in a 676-ball FCBGA package. It delivers mid-range FPGA capacity with a balance of logic resources, embedded memory, and I/O for system designs requiring configurable digital logic.

Designed for industrial applications, this surface-mount device offers approximately 30,720 logic elements, roughly 1.18 Mbits of embedded memory, and 400 user I/Os, with an operating temperature range of -40 °C to 100 °C and RoHS compliance.

Key Features

• Core Logic Approximately 30,720 logic elements, implemented across 2,400 configurable logic blocks to support custom digital designs.
• Embedded Memory Approximately 1.18 Mbits of on-chip RAM (1,179,648 bits) for buffering, FIFOs, and small data stores.
• I/O Density 400 user I/O pins to support broad interfacing and parallel connectivity requirements.
• Power Core supply voltage specified between 0.95 V and 1.05 V for the device core.
• Package & Mounting 676-FCBGA (27 × 27 mm) 676-BBGA package in a surface-mount form factor for compact board implementation.
• Temperature & Grade Industrial-grade device with an operating temperature range of -40 °C to 100 °C and RoHS compliance for environmental requirements.

Typical Applications

• Industrial Control — Implement custom logic, motor control interfaces, and real-time control functions that benefit from industrial temperature ratings.
• Communications Equipment — Support protocol implementation, parallel I/O, and data routing in infrastructure and telecom modules requiring significant I/O and logic resources.
• Signal Processing & Data Acquisition — Use the on-chip RAM and abundant logic elements for buffering, preprocessing, and custom DSP pipelines.
• Prototyping & Custom Hardware Acceleration — Rapidly develop and iterate hardware-accelerated functions using the device’s programmable fabric and dense I/O.

Unique Advantages

• High logic capacity: Approximately 30,720 logic elements enable complex custom designs without external glue logic.
• Substantial on-chip memory: About 1.18 Mbits of embedded RAM reduces reliance on external memory for intermediate storage and buffering.
• Large I/O count: 400 user I/Os allow flexible interfacing to peripherals, sensors, and parallel buses.
• Industrial temperature rating: Operation from -40 °C to 100 °C supports deployment in demanding environments.
• Compact BGA package: 676-FCBGA (27 × 27 mm) surface-mount package minimizes board footprint while providing high pin density.
• RoHS compliant: Meets lead-free and environmental requirements for regulated assemblies.

Why Choose XC5VLX30-2FF676I?

The XC5VLX30-2FF676I is positioned for designs that need a balance of programmable logic, embedded memory, and extensive I/O in an industrial-grade package. Its combination of approximately 30,720 logic elements, around 1.18 Mbits of on-chip RAM, and 400 I/Os makes it suitable for systems that require mid-range FPGA capacity with robust environmental tolerance.

With a compact 676-FCBGA package, surface-mount mounting, RoHS compliance, and a defined core voltage range, the device provides a clear set of hardware characteristics for engineers specifying FPGAs for industrial, communications, and custom processing applications.

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