XC5VLX30-2FF324I

The XC5VLX30-2FF324I is a Virtex®-5 LX field programmable gate array (FPGA) from AMD, delivered in a 324-ball FCBGA surface-mount package. It provides a high-density programmable logic resource with substantial embedded memory and I/O capacity for industrial applications.

Key on-chip resources and operating characteristics are provided to support custom digital designs that require a combination of logic capacity, memory, and a broad I/O count within a compact package.

Key Features

• Programmable Logic Capacity  30,720 logic elements to implement complex digital logic, state machines, and custom processing pipelines.
• Embedded Memory  Approximately 1.18 Mbits of on-chip RAM for buffering, FIFOs, and on-device data storage.
• I/O Count  220 user I/O pins to support multiple parallel interfaces, sensor connections, and bus implementations.
• Package and Mounting  324-FCBGA (19×19) ball-grid array in a surface-mount package for compact board-level integration.
• Power Supply  Core voltage supply range of 0.950 V to 1.05 V to match system power rails for the Virtex-5 LX architecture.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and specified as industrial grade for deployment in demanding environments.
• Environmental Compliance  RoHS-compliant device for designs requiring restriction-of-hazardous-substances conformance.

Typical Applications

• Custom Digital Systems  Implement application-specific logic, protocol bridges, and control functions using the device’s sizeable logic and memory resources.
• I/O-Intensive Interfaces  Support multiple parallel and serial interfaces with the device’s 220 I/O pins for board-level connectivity and peripheral integration.
• Embedded Memory Buffering  Use the on-chip memory for data buffering, packet queuing, or small-scale frame storage close to processing logic.
• Industrial Control  Deploy in industrial systems that require extended operating temperatures and an industrial-grade component for reliable operation.

Unique Advantages

• High Logic Density: 30,720 logic elements enable implementation of complex, custom digital functions on a single device, reducing external logic count.
• On-Device Memory: Approximately 1.18 Mbits of embedded RAM minimizes off-chip memory requirements and lowers system latency for local buffering.
• Large I/O Count: 220 I/Os provide flexibility for connecting multiple peripherals, sensors, and external buses without extensive I/O multiplexing.
• Industrial Qualification: Specified for −40 °C to 100 °C operation and listed as industrial grade for designs targeting harsher ambient conditions.
• Compact, Surface-Mount Package: 324-FCBGA (19×19) package allows dense PCB layouts while retaining the routing and thermal characteristics of a BGA solution.
• Standards-Conscious: RoHS compliance supports designs that must meet environmental substance restrictions.

Why Choose XC5VLX30-2FF324I?

The XC5VLX30-2FF324I delivers a balance of logic capacity, embedded memory, and I/O density in a compact FCBGA package, tailored for engineers developing industrial-grade programmable logic solutions. Its specified operating temperature range and industrial grade make it suitable for deployments where environmental resilience is required.

Designed and manufactured by AMD as part of the Virtex-5 LX family, this FPGA is a practical choice for teams needing a verified, high-density programmable device with on-chip memory and substantial I/O resources, offering design consolidation and board-level space savings.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC5VLX30-2FF324I.