XC5VLX30-1FFG676C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 400 1179648 30720 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,083 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1179648 |
Overview of XC5VLX30-1FFG676C – Virtex®-5 LX FPGA, 676-FCBGA, 30720 Logic Cells
The XC5VLX30-1FFG676C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD designed for commercial-grade programmable logic implementations. It integrates approximately 30,720 logic elements and approximately 1.18 Mbits of embedded memory with 400 user I/O in a 676-FCBGA package.
Designed for surface-mount assembly, this device operates from a core supply of 0.95 V to 1.05 V and is specified for an ambient operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.
Key Features
- Core Logic Approximately 30,720 logic elements provide a broad resource base for implementing custom digital logic and programmable system functions.
- Embedded Memory Approximately 1.18 Mbits of on-chip RAM supports data buffering, state storage, and small on-chip datasets.
- I/O Count 400 user I/O pins enable wide external interfacing and connectivity for complex system designs.
- Power Core supply operating range of 0.95 V to 1.05 V for the device core voltage requirement.
- Package & Mounting 676-FCBGA package (676-BBGA listing) in a 676-FCBGA (27x27) supplier device package form factor; surface-mount device suitable for standard PCB assembly.
- Temperature & Grade Commercial grade device specified for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant for regulatory and assembly compatibility.
Unique Advantages
- Substantial Logic Capacity: The approximately 30,720 logic elements provide designers with flexible resource headroom for moderate to complex logic implementations.
- On-Chip Memory: Approximately 1.18 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage needs.
- High I/O Count: 400 I/Os enable broad external device interfacing without immediate need for additional I/O expanders.
- Compact Ball-Grid Package: 676-FCBGA (27x27) packaging delivers a compact, surface-mount footprint for dense board-level integration.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with typical commercial electronic system requirements.
- Regulatory Compliance: RoHS compliance facilitates use in applications requiring lead-free assembly processes.
Why Choose XC5VLX30-1FFG676C?
The XC5VLX30-1FFG676C offers a balanced combination of logic density, embedded memory, and I/O capacity in a compact FCBGA package for commercial-grade programmable designs. Its defined core voltage range and operating temperature make it a clear option when these specific electrical and environmental parameters match system requirements.
For engineering teams and procurement seeking a Virtex®-5 LX device from AMD with defined logic, memory, and I/O resources—along with RoHS compliance and surface-mount packaging—the XC5VLX30-1FFG676C provides a clear, specification-driven building block for scalable designs.
Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX30-1FFG676C.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








