XC5VLX30-1FFG676C

IC FPGA 400 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 400 1179648 30720 676-BBGA, FCBGA

Quantity 1,083 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells30720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1179648

Overview of XC5VLX30-1FFG676C – Virtex®-5 LX FPGA, 676-FCBGA, 30720 Logic Cells

The XC5VLX30-1FFG676C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD designed for commercial-grade programmable logic implementations. It integrates approximately 30,720 logic elements and approximately 1.18 Mbits of embedded memory with 400 user I/O in a 676-FCBGA package.

Designed for surface-mount assembly, this device operates from a core supply of 0.95 V to 1.05 V and is specified for an ambient operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

  • Core Logic  Approximately 30,720 logic elements provide a broad resource base for implementing custom digital logic and programmable system functions.
  • Embedded Memory  Approximately 1.18 Mbits of on-chip RAM supports data buffering, state storage, and small on-chip datasets.
  • I/O Count  400 user I/O pins enable wide external interfacing and connectivity for complex system designs.
  • Power  Core supply operating range of 0.95 V to 1.05 V for the device core voltage requirement.
  • Package & Mounting  676-FCBGA package (676-BBGA listing) in a 676-FCBGA (27x27) supplier device package form factor; surface-mount device suitable for standard PCB assembly.
  • Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant for regulatory and assembly compatibility.

Unique Advantages

  • Substantial Logic Capacity: The approximately 30,720 logic elements provide designers with flexible resource headroom for moderate to complex logic implementations.
  • On-Chip Memory: Approximately 1.18 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage needs.
  • High I/O Count: 400 I/Os enable broad external device interfacing without immediate need for additional I/O expanders.
  • Compact Ball-Grid Package: 676-FCBGA (27x27) packaging delivers a compact, surface-mount footprint for dense board-level integration.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with typical commercial electronic system requirements.
  • Regulatory Compliance: RoHS compliance facilitates use in applications requiring lead-free assembly processes.

Why Choose XC5VLX30-1FFG676C?

The XC5VLX30-1FFG676C offers a balanced combination of logic density, embedded memory, and I/O capacity in a compact FCBGA package for commercial-grade programmable designs. Its defined core voltage range and operating temperature make it a clear option when these specific electrical and environmental parameters match system requirements.

For engineering teams and procurement seeking a Virtex®-5 LX device from AMD with defined logic, memory, and I/O resources—along with RoHS compliance and surface-mount packaging—the XC5VLX30-1FFG676C provides a clear, specification-driven building block for scalable designs.

Request a quote or submit an inquiry to obtain pricing and availability for the XC5VLX30-1FFG676C.

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