XC5VLX30-1FFG324I

The XC5VLX30-1FFG324I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) from AMD, provided in a 324-ball FCBGA package. This industrial-grade FPGA delivers a balance of programmable logic capacity, on-chip memory, and high I/O density suitable for demanding embedded and industrial deployments.

Key device attributes include approximately 30,720 logic elements, approximately 1.18 Mbits of embedded memory, 220 user I/O, a 324-FCBGA (19×19) package, and an operating temperature range of −40 °C to 100 °C, with a core supply range of 950 mV to 1.05 V.

Key Features

• Core Logic  Approximately 30,720 logic elements to implement custom digital logic and state machines for complex designs.
• Configurable Logic Blocks (CLBs)  Reported CLB count of 2,400 for structured logic partitioning and resource planning.
• Embedded Memory  Approximately 1.18 Mbits of on-chip RAM for buffering, FIFOs, and memory-mapped logic functions.
• High I/O Count  220 user I/O pins to support parallel interfaces, external peripherals, and board-level connectivity.
• Power and Voltage  Core voltage supply range of 950 mV to 1.05 V for compatibility with target power rails and system power management.
• Package and Mounting  Supplied in a 324-ball FCBGA (324-BBGA) surface-mount package; supplier package listed as 324-FCBGA (19×19).
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial ambient requirements.
• RoHS Compliant  Device is RoHS compliant for lead-free assembly and environmental regulatory alignment.

Typical Applications

• Industrial Automation  Programmable logic suited to industrial environments, leveraging the −40 °C to 100 °C operating range and industrial grade construction.
• Embedded System Development  FPGA logic capacity and on-chip RAM provide resources for custom data paths, control logic, and prototype systems.
• High-Density I/O Designs  220 user I/O enable interfacing to multiple sensors, peripherals, and parallel buses on compact PCBs.

Unique Advantages

• Significant Logic Capacity: Approximately 30,720 logic elements support complex digital designs without immediate need for external logic expansion.
• Substantial On-Chip Memory: Approximately 1.18 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
• Robust I/O Count: 220 user I/O pins provide flexibility for diverse interfacing and parallel connectivity requirements.
• Industrial-Grade Operation: Specified operating range from −40 °C to 100 °C enables deployments in temperature-challenging environments.
• Compact, Surface-Mount Package: 324-FCBGA (19×19) package allows high-density board integration while supporting surface-mount assembly.
• Regulatory Compatibility: RoHS compliance supports lead-free manufacturing processes and environmental compliance goals.

Why Choose XC5VLX30-1FFG324I?

The XC5VLX30-1FFG324I positions itself as a versatile industrial-grade FPGA option that combines sizeable programmable logic, embedded memory, and extensive I/O in a compact FCBGA package. Its industrial operating range and RoHS compliance make it suitable for designs that must meet environmental and manufacturing requirements.

Backed by AMD as the manufacturer, this device is appropriate for engineers and procurement teams seeking a field-programmable solution with clear, verifiable specifications for logic capacity, memory, I/O, power range, and temperature performance.

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