XC5VLX30-1FFG676CES
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 400 1179648 30720 676-BBGA, FCBGA |
|---|---|
| Quantity | 888 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1179648 |
Overview of XC5VLX30-1FFG676CES – Virtex®-5 LX FPGA, 676‑FCBGA (27×27)
The XC5VLX30-1FFG676CES is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC by AMD, supplied in a 676-ball FCBGA package (27×27). It provides a combination of logic density, on-chip memory, and I/O capacity suited to commercial embedded and high-density digital designs.
This device integrates 30,720 logic elements, approximately 1.18 Mbits of embedded RAM, and up to 400 user I/Os, with a core supply range of 0.95 V to 1.05 V and a commercial operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic Contains 30,720 logic elements and 2,400 configurable logic blocks (CLBs) to implement complex custom logic and control functions.
- Embedded Memory Approximately 1.18 Mbits of on-chip RAM for buffering, local storage, and intermediate data processing.
- I/O Capacity Up to 400 user I/Os to support wide parallel interfaces, multiple peripherals, or multi-channel data paths.
- Power Core voltage supply defined between 0.95 V and 1.05 V for integration with commercial power rails.
- Package 676-BBGA / 676-FCBGA (27×27) surface-mount package optimized for high-density PCB designs.
- Temperature Range Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
- Compliance RoHS compliant, meeting common environmental requirements for commercial electronic assemblies.
Typical Applications
- Commercial embedded systems Implements control logic and custom peripherals in compact, surface-mount designs for commercial products.
- High-density digital processing Leverages large logic capacity and on-chip RAM for data-path acceleration and custom processing blocks.
- Multi-interface designs Supports extensive I/O counts for bridging, protocol conversion, or parallel sensor/actuator interfaces.
Unique Advantages
- Substantial logic capacity: 30,720 logic elements enable implementation of sizeable custom logic and state machines without external ASICs.
- Significant embedded memory: Approximately 1.18 Mbits of RAM reduces dependence on external memory for many buffering and local storage needs.
- High I/O count: Up to 400 user I/Os simplify integration with multiple interfaces and parallel data channels.
- Compact BGA packaging: 676-FCBGA (27×27) allows high-density PCB layout while maintaining robust soldering and mounting for surface-mount assembly.
- Commercial-grade suitability: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
Why Choose XC5VLX30-1FFG676CES?
The XC5VLX30-1FFG676CES positions itself as a balanced solution for commercial designs that require substantial programmable logic, embedded memory, and extensive I/O in a compact surface-mount package. Its combination of 30,720 logic elements, roughly 1.18 Mbits of on-chip RAM, and 400 I/Os supports a wide range of custom digital functions while simplifying board-level integration.
This Virtex-5 LX device is suitable for teams and projects seeking a commercially graded FPGA with clear electrical and thermal operating parameters, RoHS compliance, and a high-density 676-ball FCBGA package for space-constrained PCBs.
Request a quote or submit a purchase inquiry to receive pricing and availability details for the XC5VLX30-1FFG676CES.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








