XC5VLX30T-1FF323I

IC FPGA 172 I/O 323FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 1327104 30720 323-BBGA, FCBGA

Quantity 251 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package323-FCBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case323-BBGA, FCBGANumber of I/O172Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells30720
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1327104

Overview of XC5VLX30T-1FF323I – Virtex®-5 LXT Field Programmable Gate Array, 323-FCBGA (19×19)

The XC5VLX30T-1FF323I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) in a 323-FCBGA package designed for industrial applications. It provides a programmable logic fabric with 30,720 logic elements, approximately 1.33 Mbits of embedded memory, and up to 172 user I/O pins to support complex digital designs.

With an industrial operating range from -40 °C to 100 °C and a nominal core supply range of 0.95 V to 1.05 V, this device targets developers requiring robust, high-capacity programmable logic in a compact surface-mount package.

Key Features

  • Programmable Logic Capacity 30,720 logic elements provide substantial on-chip logic resources for implementing complex digital functions and custom processing pipelines.
  • Embedded Memory Approximately 1.33 Mbits of on-chip RAM to support data buffering, FIFO structures, and local storage for compute blocks.
  • I/O Resources Up to 172 user I/O pins to interface with external peripherals, buses, and high-speed I/O fabrics.
  • Power Supply Core voltage supply specified from 950 mV to 1.05 V, enabling predictable power planning for the FPGA core.
  • Package and Mounting 323-FCBGA (19×19) surface-mount package (323-BBGA, FCBGA) suitable for compact, board-level integration.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet a wide range of environmental conditions.
  • Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

  • High-density digital processing — Implement compute-intensive logic and custom data paths using the 30,720 logic elements and embedded memory for intermediate storage.
  • Interface bridging and I/O aggregation — Use the 172 I/O pins to connect multiple peripherals, sensors, or bus standards in a single programmable device.
  • Industrial control systems — Deploy in industrial designs that require operation across a wide temperature range and a reliable surface-mount package.

Unique Advantages

  • Substantial on-chip logic: 30,720 logic elements enable complex implementations without immediately requiring external ASICs or multiple FPGAs.
  • Significant embedded memory: Approximately 1.33 Mbits of RAM supports buffering and local data storage to reduce external memory dependence.
  • Extensive I/O capability: 172 user I/O pins allow flexible connectivity to peripherals and external devices, simplifying system partitioning.
  • Industrial-grade thermal range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compact, board-friendly package: 323-FCBGA (19×19) surface-mount package helps conserve PCB area while providing a high pin count.
  • Regulatory readiness: RoHS compliance facilitates manufacturing and regulatory acceptance.

Why Choose XC5VLX30T-1FF323I?

The XC5VLX30T-1FF323I positions itself as a high-capacity Virtex®-5 LXT FPGA option for industrial designs that need a balance of programmable logic, on-chip memory, and extensive I/O in a compact FCBGA package. Its specified core voltage range and wide operating temperature make it appropriate for boards where predictable power behavior and environmental resilience are required.

This device is well suited for engineering teams designing medium- to high-density digital systems who value on-chip resources to minimize external components, streamline BOM, and consolidate functionality into a single programmable device.

Request a quote or submit a pricing inquiry to learn about availability and lead times for the XC5VLX30T-1FF323I.

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