XC5VLX30T-1FFG323C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 172 1327104 30720 323-BBGA, FCBGA |
|---|---|
| Quantity | 863 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 323-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 323-BBGA, FCBGA | Number of I/O | 172 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2400 | Number of Logic Elements/Cells | 30720 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1327104 |
Overview of XC5VLX30T-1FFG323C – Virtex®-5 LXT FPGA, 323-BBGA (FCBGA)
The XC5VLX30T-1FFG323C is a Virtex®-5 LXT Field Programmable Gate Array supplied in a 323-ball FCBGA package. It combines a large logic fabric with on-chip memory and a substantial number of I/O to address demanding digital designs requiring flexible hardware programmability.
Designed for commercial-grade applications, this device provides a balance of dense logic resources, embedded memory, and I/O capability while operating within a defined supply and temperature range suitable for mainstream electronic systems.
Key Features
- Logic Resources 2,400 configurable logic blocks (CLBs) delivering 30,720 logic elements for implementing complex digital functions.
- Embedded Memory Approximately 1.33 Mbits of on-chip RAM to support buffering, lookup tables, and state retention within logic designs.
- I/O Capacity 172 I/O pins to interface with external devices and peripherals, enabling broad connectivity for system-level integration.
- Package and Mounting 323-ball BGA FCBGA package (19 × 19 mm) designed for surface-mount assembly in compact board layouts.
- Power Operates with a supply range of 950 mV to 1.05 V, allowing precise power provisioning for the device.
- Temperature and Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- RoHS Compliance RoHS-compliant construction consistent with common environmental requirements.
Typical Applications
- High-density digital processing Use the device's 30,720 logic elements and embedded memory to implement signal processing pipelines, state machines, and custom datapaths.
- Communications equipment Leverage the 172 I/O channels and programmable logic to handle protocol interfaces, packet processing, and timing-critical logic.
- Hardware acceleration and prototyping Ideal for accelerating algorithms in hardware or validating system-level designs that need reconfigurable logic and on-chip RAM.
Unique Advantages
- Large programmable fabric: Provides substantial logic capacity (30,720 logic elements) to implement complex functions without partitioning across multiple devices.
- Significant embedded memory: Approximately 1.33 Mbits of on-chip RAM reduces the need for external memory for many buffering and lookup requirements.
- Ample I/O count: 172 I/O pins give designers flexibility to connect multiple peripherals and interface standards directly to the FPGA.
- Compact BGA package: The 323-ball FCBGA (19 × 19) footprint supports high-density PCB designs while maintaining surface-mount assembly compatibility.
- Defined power envelope: A clear supply range of 950 mV to 1.05 V facilitates predictable power budgeting in system designs.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic applications.
Why Choose XC5VLX30T-1FFG323C?
The XC5VLX30T-1FFG323C positions itself as a capable Virtex-5 LXT FPGA option for designers seeking a balance of logic density, embedded memory, and I/O in a compact FCBGA package. Its specifications make it suitable for complex digital implementations, communications interfaces, and hardware acceleration projects within commercial-temperature systems.
For teams focused on scalable FPGA-based designs, this device offers a clear set of resources—logic elements, on-chip RAM, and I/O—backed by RoHS-compliant manufacturing and a defined supply and temperature envelope to support reliable integration into production hardware.
Request a quote or submit your procurement inquiry to receive pricing and availability for the XC5VLX30T-1FFG323C.

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