XC5VLX50-1FFG676C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 1769472 46080 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,759 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 440 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-1FFG676C – Virtex®-5 LX Field Programmable Gate Array (676-FCBGA 27×27)
The XC5VLX50-1FFG676C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD, offered in a 676-FCBGA package. It provides a balance of logic capacity, embedded memory, and I/O resources for commercial-grade programmable logic designs.
Key Features
- Logic Capacity 46,080 logic elements for implementing custom digital logic and complex designs.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM to support data buffering, state storage, and local memory requirements.
- I/O Resources 440 user I/O pins to accommodate extensive peripheral and interface connectivity.
- Power Supply Operates from a core voltage supply range of 950 mV to 1.05 V.
- Package and Mounting 676-BBGA / 676-FCBGA (27×27) package in a surface-mount form factor for high-density board integration.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C, suitable for commercial applications.
- Compliance RoHS compliant.
Typical Applications
- Commercial System Integration Deploy configurable logic in commercial electronic products where reprogrammable hardware is required.
- Custom Digital Processing Implement application-specific datapaths and control logic using the device’s available logic elements and embedded RAM.
- High-Connector I/O Designs Support multiple peripherals and interfaces using the device’s 440 I/O pins for flexible board-level integration.
Unique Advantages
- Substantial Logic Resource: 46,080 logic elements enable the implementation of sizeable custom logic and integration of multiple functions on a single device.
- On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces external memory dependency and simplifies system architecture.
- High I/O Count: 440 I/O pins provide broad interfacing options for peripherals, sensors, and communication links.
- Compact Surface-Mount Package: The 676-FCBGA (27×27) package offers a dense, board-friendly form factor for space-constrained designs.
- Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliance, aligning with commercial product requirements.
- Controlled Core Voltage Range: Core supply range of 950 mV to 1.05 V for predictable power integration.
Why Choose XC5VLX50-1FFG676C?
The XC5VLX50-1FFG676C offers a combination of 46,080 logic elements, approximately 1.77 Mbits of embedded RAM, and 440 I/O pins in a compact 676-FCBGA surface-mount package, positioned for commercial FPGA applications. Its electrical and thermal parameters are specified for commercial use, making it suitable for designers seeking a configurable, high-density programmable logic device in that grade.
Backed by AMD manufacturing, this Virtex®-5 LX device provides a clear, specification-driven option for teams building scalable, reconfigurable hardware where on-chip logic, memory, and connectivity must be balanced within a compact package.
Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX50-1FFG676C.

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