XC5VLX50-1FFG676CES
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 1769472 46080 676-BBGA, FCBGA |
|---|---|
| Quantity | 636 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 440 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-1FFG676CES – Virtex®-5 LX Field Programmable Gate Array, 676-FCBGA (27×27)
The XC5VLX50-1FFG676CES is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC designed for commercial-grade, board-level integration. It combines a high count of configurable logic resources with substantial on-chip memory and a large I/O complement in a 676-ball FCBGA package.
Key device characteristics include 3,600 configurable logic blocks (CLBs) totaling 46,080 logic elements, approximately 1.77 Mbits of embedded memory, 440 user I/Os, and operation across a 0.95–1.05 V supply range and 0 °C to 85 °C temperature range.
Key Features
- Core Logic 3,600 configurable logic blocks (CLBs) providing a total of 46,080 logic elements for implementing complex digital designs.
- Embedded Memory Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) to support buffering, state storage, and algorithm working memory.
- I/O Capacity 440 user I/O pins to accommodate wide, parallel interfaces and multiple peripheral connections on a single device.
- Power and Voltage Core voltage supply range of 0.95 V to 1.05 V to match system power rails and maintain device operation within specified limits.
- Package and Mounting 676-ball FCBGA package (676-BBGA, 27×27) in a surface-mount format for compact, high-density board layouts.
- Operating Conditions Commercial-grade operation across 0 °C to 85 °C for typical commercial-environment applications.
- Regulatory Status RoHS compliant.
Typical Applications
- High-density digital systems Use the 46,080 logic elements and approximately 1.77 Mbits of embedded memory for complex digital processing and control functions.
- I/O-intensive designs The 440 user I/Os enable wide parallel interfaces and multiple peripheral connections without external multiplexing.
- Compact board-level solutions The 676-FCBGA (27×27) surface-mount package supports space-constrained PCB layouts while keeping logic and memory on-chip.
- Prototyping and system integration The combination of CLBs, logic elements, and on-chip RAM supports design validation and integration of multiple functions on a single FPGA.
Unique Advantages
- High logic capacity: 46,080 logic elements enable substantial on-chip implementation of complex logic and custom datapaths.
- Significant embedded memory: Approximately 1.77 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
- Large I/O count: 440 user I/Os simplify system-level partitioning and reduce the need for external I/O expanders.
- Compact, high-density package: 676-FCBGA (27×27) surface-mount package supports dense board layouts and efficient use of PCB area.
- Commercial operating range: Rated for 0 °C to 85 °C operation to meet typical commercial application environments.
- RoHS compliant: Conforms to RoHS requirements for lead-free assembly and environmental compliance.
Why Choose XC5VLX50-1FFG676CES?
The XC5VLX50-1FFG676CES delivers a balanced combination of logic density, embedded memory, and extensive I/O in a compact FCBGA package, making it well-suited for engineers needing on-chip resources to consolidate functions and simplify board-level designs. Its commercial-grade temperature range and RoHS compliance support deployment in standard commercial applications where integration and board density are priorities.
Backed by AMD as the manufacturer, this Virtex®-5 LX FPGA provides clear, verifiable device specifications—logic elements, CLBs, embedded RAM, I/O count, package, and operating conditions—for designers who require known hardware parameters when planning system architectures and procurement.
If you would like pricing, availability, or to request a formal quote for the XC5VLX50-1FFG676CES, please submit a quote request or contact sales to get more details and support for your design requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








