XC5VLX50-1FFG676I

The XC5VLX50-1FFG676I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD, offering a hardware-programmable platform with a large logic capacity and significant on-chip memory. It is specified as an industrial-grade device and is suitable for embedded and industrial systems that require extended operating temperature and high I/O density.

Key Features

• Logic Capacity  Provides 46,080 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded Memory  Includes approximately 1.77 Mbits of embedded memory for buffering, FIFOs, and on-chip data storage.
• High I/O Count  440 general-purpose I/O pins enable dense interfacing with peripherals, sensors, and external devices.
• Power Supply  Core voltage supply range specified at 0.95 V to 1.05 V for the FPGA core power rails.
• Package and Mounting  Supplied in a 676-ball FCBGA package (supplier device package: 676-FCBGA, 27 × 27), with surface-mount mounting for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting deployments that require extended temperature tolerance.
• Standards Compliance  RoHS compliant, meeting common lead-free environmental requirements for electronics manufacturing.

Typical Applications

• Industrial Automation  Implement control logic, motion control interfaces, and real-time data processing in industrial systems where extended temperature range is required.
• Embedded Systems  Provide customizable hardware acceleration and interface aggregation for embedded platforms that need high logic density and on-chip memory.
• Communications and I/O Aggregation  Use the high I/O count to consolidate multiple digital interfaces and protocol handling in communication equipment and test systems.

Unique Advantages

• Substantial Logic Resources: 46,080 logic elements enable implementation of sizeable custom hardware functions without external logic expansion.
• On-chip Memory for Data Handling: Approximately 1.77 Mbits of embedded memory supports buffering and low-latency data storage directly on the FPGA fabric.
• High I/O Density: 440 I/O pins simplify board design by allowing direct connections to many peripherals and interfaces.
• Industrial Temperature Rating: −40 °C to 100 °C operating range makes the device suitable for a wide range of industrial environments.
• Compact BGA Packaging: 676-ball FCBGA (27 × 27) packaging provides a high pin count in a compact footprint for space-constrained designs.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmental and regulatory compatibility.

Why Choose XC5VLX50-1FFG676I?

The XC5VLX50-1FFG676I combines a large pool of logic elements, meaningful on-chip memory, and a very high I/O count in a compact industrial-grade FCBGA package. Its specified core voltage range and extended operating temperature make it a practical choice for embedded and industrial designs that require reliable programmable logic with high integration density.

This part is suited to engineers and procurement teams targeting scalable FPGA-based implementations where board space, I/O capacity, and temperature tolerance are key selection criteria.

Request a quote or submit a pricing and availability inquiry to evaluate XC5VLX50-1FFG676I for your next design.