XC5VLX50-2FFG1153C

The XC5VLX50-2FFG1153C is a Virtex®-5 LX field programmable gate array (FPGA) IC from AMD. It provides a balance of logic capacity, embedded memory and high I/O density in a 1153-ball FCBGA package suited for commercial embedded and board-level designs. Typical uses include programmable logic implementations where a combination of substantial on-chip resources and a compact surface-mount package are required.

Key Features

• Logic Capacity  46,080 logic elements suitable for medium- to high-complexity logic implementations.
• Configurable Logic Blocks  3,600 CLBs provide structured resources for synthesizable logic (as listed in device data).
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM to support data buffering, FIFOs and local storage without external memory.
• High I/O Count  560 I/O pins to enable dense board-level connectivity and multiple interface requirements.
• Package and Mounting  1153-BBGA / 1153-FCBGA package (35 × 35 mm) with surface-mount mounting type for compact PCB integration.
• Power and Temperature  Core voltage range of 950 mV to 1.05 V and commercial operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing environments.

Typical Applications

• High-density I/O systems  Use the 560 I/Os to interface multiple peripherals and board-level signals without external multiplexing.
• Embedded logic acceleration  Deploy the 46,080 logic elements to implement custom data paths, parallel processing or protocol offload functions.
• Memory-buffered designs  Leverage approximately 1.77 Mbits of embedded RAM for on-chip buffering, FIFO staging and local storage.
• Compact PCB implementations  The 1153-FCBGA (35×35) surface-mount package supports space-constrained boards while keeping high integration.

Unique Advantages

• Substantial logic resources: 46,080 logic elements enable implementation of complex, custom logic functions without immediate external logic.
• Significant on-chip memory: Approximately 1.77 Mbits of embedded RAM reduces dependence on external memory for many buffering tasks.
• High I/O density: 560 I/Os accommodate multiple interfaces and parallel signal paths on a single device.
• Compact FCBGA package: The 1153-ball FCBGA (35×35) offers high integration in a surface-mount form factor for modern PCB layouts.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments and environments.
• RoHS compliant: Supports lead-free assembly processes and regulatory compliance for many manufacturing flows.

Why Choose XC5VLX50-2FFG1153C?

The XC5VLX50-2FFG1153C delivers a combination of logic capacity, embedded memory and a high I/O count in a compact 1153-FCBGA surface-mount package from AMD. Its specified core voltage range and commercial temperature rating make it suitable for a wide range of board-level programmable logic applications where on-chip resources and dense connectivity matter.

This part is appropriate for designers seeking a commercially rated FPGA with integrated RAM and substantial logic for prototyping, custom acceleration and multi-interface designs, while maintaining RoHS compliance for modern manufacturing requirements.

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