XC5VLX50-2FFG676C

The XC5VLX50-2FFG676C is a Virtex-5 LX Field Programmable Gate Array (FPGA) IC supplied in a 676-BBGA FCBGA package. It provides high logic capacity and extensive I/O for designers building complex digital systems.

Key hardware characteristics include 46,080 logic elements, approximately 1.77 Mbits of embedded memory, and 440 user I/O pins, with a surface-mount 676-FCBGA (27×27) package and commercial-grade operating range.

Key Features

• Core Logic: 46,080 logic elements for implementing large-scale custom digital logic and control functions.
• Embedded Memory: Approximately 1.77 Mbits of on-chip RAM for buffering, local data storage, and state machines.
• I/O Density: 440 user I/O pins to support multiple interfaces, parallel buses, and high-channel-count designs.
• Package & Mounting: 676-BBGA, FCBGA (supplier package 676‑FCBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Power: Core voltage supply range of 0.95 V to 1.05 V to match low-voltage system cores and regulators.
• Temperature & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance: RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-density digital logic: Implement custom processing pipelines, protocol handlers, and large combinational or sequential logic blocks using the device’s 46,080 logic elements.
• I/O-rich systems: Aggregate sensors, interfaces, or parallel links where 440 I/O pins enable broad connectivity without external multiplexing.
• Embedded memory buffering: Use the approximately 1.77 Mbits of on-chip RAM for packet buffering, FIFO storage, or local data tables in real-time designs.
• Compact, surface-mount designs: Integrate into tight PCB layouts with the 676-FCBGA surface-mount package for space-constrained products.

Unique Advantages

• High logic capacity: 46,080 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Significant on-chip RAM: Approximately 1.77 Mbits of embedded memory supports local buffering and state storage without external memory.
• Extensive I/O availability: 440 I/O pins simplify system integration by accommodating numerous interfaces directly on-chip.
• Compact FCBGA footprint: 676‑BBGA (27×27) packaging enables high-density PCB implementations in surface-mount designs.
• Low-voltage core operation: Support for 0.95–1.05 V core supply aligns with modern low-voltage power rails.
• RoHS compliant: Meets lead-free manufacturing requirements for commercial production environments.

Why Choose XC5VLX50-2FFG676C?

The XC5VLX50-2FFG676C delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact surface-mount package, making it suitable for designers who need to integrate substantial custom digital functions and connectivity onto a single FPGA. Its commercial-grade temperature range and RoHS compliance support standard production environments.

This device is well suited for development teams and integrators building mid-to-high complexity digital systems that benefit from on-chip memory and high I/O counts, offering a scalable platform for consolidating multiple functions and simplifying board-level designs.

Request a quote or submit a sales inquiry for the XC5VLX50-2FFG676C to discuss availability, pricing, and how it can fit into your next design.