XC5VLX50-3FFG1153C

The XC5VLX50-3FFG1153C is an AMD Virtex®-5 LX Field Programmable Gate Array (FPGA) in a 1153-ball FCBGA package. It provides a high-density programmable fabric with 46,080 logic elements, approximately 1.77 Mbits of embedded RAM, and 560 I/Os for complex digital designs.

Designed for commercial applications, this surface-mount FPGA operates from a 0.95 V to 1.05 V core supply and supports an operating temperature range of 0 °C to 85 °C. RoHS compliance is included.

Key Features

• Core Logic Capacity — 46,080 logic elements for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• High I/O Count — 560 I/O pins to support multiple interfaces, parallel buses, and external peripherals.
• Power — Core voltage supply range of 0.95 V to 1.05 V for the device core.
• Package & Mounting — 1153-FCBGA (35 × 35) / 1153-BBGA package in a surface-mount form factor for compact board integration.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS-compliant manufacturing.

Typical Applications

• High-density digital processing — Implement custom logic blocks and control systems using the 46,080 logic elements and on-chip RAM.
• I/O-intensive interfaces — Support multi-channel connectivity and board-level bridging with 560 available I/Os.
• System integration and prototyping — Combine logic, memory, and I/O in a single FPGA for rapid integration and iterative hardware development.

Unique Advantages

• High integration density: 46,080 logic elements reduce the need for multiple discrete devices by consolidating logic on-chip.
• Substantial embedded memory: Approximately 1.77 Mbits of on-chip RAM enables local buffering and state storage without external memory.
• Extensive I/O resource: 560 I/Os allow flexible interfacing to sensors, peripherals, and parallel buses.
• Compact FCBGA package: 1153-FCBGA (35 × 35) offers a small footprint for high-density PCB assemblies.
• Commercial temperature rating: 0 °C to 85 °C supports a wide range of non-industrial applications.
• RoHS compliant: Meets environmental regulations for lead-free assembly.

Why Choose XC5VLX50-3FFG1153C?

The XC5VLX50-3FFG1153C combines substantial logic capacity, embedded memory, and a high I/O count in a compact 1153-FCBGA package, making it suitable for commercial designs that require integrated digital processing and extensive interfacing. Its defined core voltage range and commercial temperature rating make it a predictable choice for board-level integration and system prototyping.

This part is well suited to engineering teams and procurement looking for a programmable device with clear, verifiable specifications—46,080 logic elements, approximately 1.77 Mbits of on-chip RAM, 560 I/Os, surface-mount FCBGA packaging, and RoHS compliance.

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