XC5VLX50-3FF324C

IC FPGA 220 I/O 324FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 220 1769472 46080 324-BBGA, FCBGA

Quantity 900 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BBGA, FCBGANumber of I/O220Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1769472

Overview of XC5VLX50-3FF324C – Virtex®-5 LX Field Programmable Gate Array, 324-FCBGA

The XC5VLX50-3FF324C is a Virtex‑5 LX Field Programmable Gate Array (FPGA) in a 324‑ball FCBGA package. It provides high-density programmable logic resources, embedded memory, and a broad I/O count in a surface‑mount package for commercial applications.

Designed for systems that require significant on-chip logic and memory capacity, this device delivers 46,080 logic elements and approximately 1.77 Mbits of embedded RAM while operating from a 0.95–1.05 V core supply within a commercial temperature range.

Key Features

  • Logic Capacity 3,600 CLBs providing a total of 46,080 logic elements for implementing complex digital functions and custom logic.
  • Embedded Memory Approximately 1.77 Mbits (1,769,472 bits) of on-chip RAM to support buffering, state storage, and intermediate data processing.
  • I/O Resources 220 user I/O pins to interface with peripherals, memory, and external logic in high‑pin‑count systems.
  • Package & Mounting 324‑FBG A package (324‑FCBGA, 19 × 19) in a surface mount format for compact board-level integration.
  • Power and Temperature Core supply range of 0.95 V to 1.05 V; rated for commercial operation from 0 °C to 85 °C.
  • Regulatory RoHS compliant for environmentally conscious manufacturing and assembly processes.

Unique Advantages

  • High Logic Density: 46,080 logic elements enable complex FPGA implementations without external logic expansion.
  • Substantial On‑Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces the need for external memory in many designs.
  • Generous I/O Count: 220 I/O pins provide flexibility for interfacing with a variety of external components and systems.
  • Compact, Surface‑Mount Package: 324‑FCBGA (19 × 19) offers a space‑efficient footprint for board designs requiring high pin density.
  • Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match a wide range of commercial electronic applications.
  • RoHS Compliant: Supports compliance with environmental regulations for lead‑free assembly.

Why Choose XC5VLX50-3FF324C?

The XC5VLX50-3FF324C positions itself as a high‑density Virtex‑5 LX FPGA suitable for commercial designs that require substantial programmable logic, on‑chip memory, and a large number of I/O connections in a compact FCBGA package. Its specified core voltage range and commercial temperature rating make it appropriate for a broad set of board‑level implementations.

Choosing this device provides designers with a balance of logic capacity, embedded RAM, and I/O flexibility, all in a RoHS‑compliant surface‑mount package that supports scalable and reliable system integration.

Request a quote or submit your procurement inquiry to obtain pricing and availability for the XC5VLX50-3FF324C.

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