XC5VLX50-3FF324C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 220 1769472 46080 324-BBGA, FCBGA |
|---|---|
| Quantity | 900 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BBGA, FCBGA | Number of I/O | 220 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1769472 |
Overview of XC5VLX50-3FF324C – Virtex®-5 LX Field Programmable Gate Array, 324-FCBGA
The XC5VLX50-3FF324C is a Virtex‑5 LX Field Programmable Gate Array (FPGA) in a 324‑ball FCBGA package. It provides high-density programmable logic resources, embedded memory, and a broad I/O count in a surface‑mount package for commercial applications.
Designed for systems that require significant on-chip logic and memory capacity, this device delivers 46,080 logic elements and approximately 1.77 Mbits of embedded RAM while operating from a 0.95–1.05 V core supply within a commercial temperature range.
Key Features
- Logic Capacity 3,600 CLBs providing a total of 46,080 logic elements for implementing complex digital functions and custom logic.
- Embedded Memory Approximately 1.77 Mbits (1,769,472 bits) of on-chip RAM to support buffering, state storage, and intermediate data processing.
- I/O Resources 220 user I/O pins to interface with peripherals, memory, and external logic in high‑pin‑count systems.
- Package & Mounting 324‑FBG A package (324‑FCBGA, 19 × 19) in a surface mount format for compact board-level integration.
- Power and Temperature Core supply range of 0.95 V to 1.05 V; rated for commercial operation from 0 °C to 85 °C.
- Regulatory RoHS compliant for environmentally conscious manufacturing and assembly processes.
Unique Advantages
- High Logic Density: 46,080 logic elements enable complex FPGA implementations without external logic expansion.
- Substantial On‑Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces the need for external memory in many designs.
- Generous I/O Count: 220 I/O pins provide flexibility for interfacing with a variety of external components and systems.
- Compact, Surface‑Mount Package: 324‑FCBGA (19 × 19) offers a space‑efficient footprint for board designs requiring high pin density.
- Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match a wide range of commercial electronic applications.
- RoHS Compliant: Supports compliance with environmental regulations for lead‑free assembly.
Why Choose XC5VLX50-3FF324C?
The XC5VLX50-3FF324C positions itself as a high‑density Virtex‑5 LX FPGA suitable for commercial designs that require substantial programmable logic, on‑chip memory, and a large number of I/O connections in a compact FCBGA package. Its specified core voltage range and commercial temperature rating make it appropriate for a broad set of board‑level implementations.
Choosing this device provides designers with a balance of logic capacity, embedded RAM, and I/O flexibility, all in a RoHS‑compliant surface‑mount package that supports scalable and reliable system integration.
Request a quote or submit your procurement inquiry to obtain pricing and availability for the XC5VLX50-3FF324C.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








