XC5VLX50-2FF676I

The XC5VLX50-2FF676I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) from AMD, supplied in a 676-FCBGA (27×27) surface-mount package. It is specified as an industrial-grade device for designs that require programmable logic, on-chip memory, and extensive I/O capability.

Key hardware characteristics include 46,080 logic elements, approximately 1.77 Mbits of embedded RAM, and up to 440 I/O pins. The device operates from 0.95 V to 1.05 V and across an industrial temperature range of –40°C to 100°C.

Key Features

• Core Logic 46,080 logic elements (logic cells) provide programmable gate resources for custom digital designs.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM for data buffering, state storage, and lookup tables.
• I/O Capacity Up to 440 general-purpose I/O pins to support a wide range of external interfaces and peripherals.
• Power Supply Operates from a core voltage range of 0.95 V to 1.05 V to meet system power requirements.
• Package and Mounting 676‑BBGA / 676‑FCBGA (27×27) package in a surface-mount form factor suited for dense board layouts.
• Operating Range Industrial temperature rating from –40°C to 100°C for use in temperature-demanding environments.
• Regulatory Compliance RoHS compliant, supporting lead‑free assembly and regulatory requirements.

Typical Applications

• Industrial Control and Automation Programmable logic and on-chip memory enable custom control algorithms and real-time processing in industrial systems.
• High-density I/O Systems Up to 440 I/O pins allow integration of multiple sensors, actuators, and communication interfaces on a single device.
• Custom Interface and Bridge Logic Use as protocol bridging or glue logic where significant programmable logic and memory are required.

Unique Advantages

• Significant logic capacity: 46,080 logic elements provide ample resources for complex custom logic implementations.
• Substantial embedded memory: Approximately 1.77 Mbits of on-chip RAM reduces dependence on external memory for buffering and state storage.
• Extensive I/O availability: 440 I/O pins support dense connectivity to peripherals and external subsystems.
• Industrial temperature rating: Specified for –40°C to 100°C operation to meet demanding environmental requirements.
• Compact BGA package: 676‑FCBGA (27×27) surface-mount package enables high-density PCB integration.
• RoHS compliant: Supports lead-free manufacturing and environmental compliance.

Why Choose XC5VLX50-2FF676I?

The XC5VLX50-2FF676I balances substantial programmable logic, embedded memory, and broad I/O in a single industrial‑grade FPGA package from AMD. Its combination of 46,080 logic elements, approximately 1.77 Mbits of on-chip RAM, and up to 440 I/O pins makes it suitable for designs that require compact, flexible digital logic and interface capability within an industrial temperature envelope.

This device is appropriate for engineers and procurement teams building systems that need scalable programmable logic, robust thermal range, and a compact BGA footprint. Its RoHS compliance further supports modern manufacturing and regulatory needs.

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