XC5VLX50T-3FFG1136C

IC FPGA 480 I/O 1136FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 480 2211840 46080 1136-BBGA, FCBGA

Quantity 428 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1136-BBGA, FCBGANumber of I/O480Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs3600Number of Logic Elements/Cells46080
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2211840

Overview of XC5VLX50T-3FFG1136C – Virtex®-5 LXT Field Programmable Gate Array, 1136-FCBGA

The XC5VLX50T-3FFG1136C is a Virtex®-5 LXT field programmable gate array (FPGA) by AMD provided in a 1136-ball FCBGA package. It delivers a high count of programmable logic resources, on-chip memory, and I/O for general-purpose FPGA applications that require substantial integration on a commercial-grade device.

This surface-mount FPGA operates from a core supply of 0.95 V to 1.05 V and supports commercial temperature operation from 0 °C to 85 °C, making it suitable for standard embedded and electronic system designs that target these environmental and power envelopes.

Key Features

  • FPGA Architecture  Virtex®-5 LXT field programmable gate array architecture in a 1136-FCBGA package, designed for programmable logic implementation.
  • Logic Resources  Approximately 46,080 logic elements to implement complex digital functions and custom processing pipelines.
  • Embedded Memory  Approximately 2.21 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
  • I/O Capacity  480 I/O pins to support wide parallel interfaces and multi-channel connectivity.
  • Package and Mounting  1136-FCBGA (35x35) supplier package in a 1136-ball BGA form factor; surface-mount assembly compatible.
  • Power and Temperature  Core supply range of 0.95 V to 1.05 V and commercial-grade operating range from 0 °C to 85 °C.
  • Compliance  RoHS compliant for regulatory adherence in standard commercial applications.

Unique Advantages

  • High integration density: The large count of logic elements and on-chip RAM reduces the need for external components and simplifies board-level design.
  • Extensive I/O: 480 I/O pins enable broad interface options for parallel data paths and multiple peripherals without external multiplexing.
  • Compact BGA footprint: 1136-FCBGA packaging provides a compact, ball-grid layout suitable for high-density PCB designs and surface-mount assembly.
  • Low-voltage core operation: The 0.95 V–1.05 V supply range supports low-voltage core designs and helps manage overall power consumption within the device’s operating envelope.
  • Commercial-grade suitability: Specified 0 °C to 85 °C operating temperature and RoHS compliance match standard commercial product requirements.

Why Choose XC5VLX50T-3FFG1136C?

The XC5VLX50T-3FFG1136C positions itself as a high-capacity Virtex®-5 LXT FPGA for designers who need substantial logic resources, embedded memory, and broad I/O in a single commercial-grade device. Its 1136-FCBGA package and surface-mount form factor make it suitable for compact, high-density board designs.

This part is appropriate for development teams and OEMs seeking a programmable logic solution with a balance of logic capacity, on-chip RAM, and I/O density, and who require RoHS-compliant hardware from a recognized manufacturer.

If you would like pricing, lead-time information, or to request a formal quote for the XC5VLX50T-3FFG1136C, please submit an inquiry with your quantity and delivery requirements.

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