XC5VLX50T-3FFG1136C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 480 2211840 46080 1136-BBGA, FCBGA |
|---|---|
| Quantity | 428 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 480 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3600 | Number of Logic Elements/Cells | 46080 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2211840 |
Overview of XC5VLX50T-3FFG1136C – Virtex®-5 LXT Field Programmable Gate Array, 1136-FCBGA
The XC5VLX50T-3FFG1136C is a Virtex®-5 LXT field programmable gate array (FPGA) by AMD provided in a 1136-ball FCBGA package. It delivers a high count of programmable logic resources, on-chip memory, and I/O for general-purpose FPGA applications that require substantial integration on a commercial-grade device.
This surface-mount FPGA operates from a core supply of 0.95 V to 1.05 V and supports commercial temperature operation from 0 °C to 85 °C, making it suitable for standard embedded and electronic system designs that target these environmental and power envelopes.
Key Features
- FPGA Architecture Virtex®-5 LXT field programmable gate array architecture in a 1136-FCBGA package, designed for programmable logic implementation.
- Logic Resources Approximately 46,080 logic elements to implement complex digital functions and custom processing pipelines.
- Embedded Memory Approximately 2.21 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
- I/O Capacity 480 I/O pins to support wide parallel interfaces and multi-channel connectivity.
- Package and Mounting 1136-FCBGA (35x35) supplier package in a 1136-ball BGA form factor; surface-mount assembly compatible.
- Power and Temperature Core supply range of 0.95 V to 1.05 V and commercial-grade operating range from 0 °C to 85 °C.
- Compliance RoHS compliant for regulatory adherence in standard commercial applications.
Unique Advantages
- High integration density: The large count of logic elements and on-chip RAM reduces the need for external components and simplifies board-level design.
- Extensive I/O: 480 I/O pins enable broad interface options for parallel data paths and multiple peripherals without external multiplexing.
- Compact BGA footprint: 1136-FCBGA packaging provides a compact, ball-grid layout suitable for high-density PCB designs and surface-mount assembly.
- Low-voltage core operation: The 0.95 V–1.05 V supply range supports low-voltage core designs and helps manage overall power consumption within the device’s operating envelope.
- Commercial-grade suitability: Specified 0 °C to 85 °C operating temperature and RoHS compliance match standard commercial product requirements.
Why Choose XC5VLX50T-3FFG1136C?
The XC5VLX50T-3FFG1136C positions itself as a high-capacity Virtex®-5 LXT FPGA for designers who need substantial logic resources, embedded memory, and broad I/O in a single commercial-grade device. Its 1136-FCBGA package and surface-mount form factor make it suitable for compact, high-density board designs.
This part is appropriate for development teams and OEMs seeking a programmable logic solution with a balance of logic capacity, on-chip RAM, and I/O density, and who require RoHS-compliant hardware from a recognized manufacturer.
If you would like pricing, lead-time information, or to request a formal quote for the XC5VLX50T-3FFG1136C, please submit an inquiry with your quantity and delivery requirements.

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