XC5VLX85-1FF676I

The XC5VLX85-1FF676I is a Virtex®-5 LX field programmable gate array (FPGA) from AMD, supplied in a 676‑ball FCBGA package. It provides a large programmable fabric combined with significant on‑chip memory and a wide I/O complement for demanding embedded and industrial applications.

Designed for systems that require substantial logic resources, on‑chip RAM, and robust operating conditions, this device supports designs that benefit from a high logic element count, extensive I/O, and an industrial temperature range.

Key Features

• Programmable Logic Capacity  Approximately 82,944 logic elements suitable for complex custom logic implementations and parallel processing architectures.
• Embedded Memory  Approximately 3.538944 Mbits of on‑chip RAM, enabling local buffering, FIFOs, and data‑path storage without external memory in many designs.
• I/O Resources  440 user I/O pins to support wide buses, multiple interfaces, and flexible connectivity options for peripherals and daughtercards.
• Power Supply  Core supply range of 0.95 V to 1.05 V to match system power‑rail requirements and enable predictable power sequencing.
• Package and Mounting  676‑ball FCBGA (27 × 27 mm) surface‑mount package for high‑density board integration and reliable soldered connections.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting extended temperature environments common in industrial and ruggedized systems.
• Compliance  RoHS compliant, meeting common environmental requirements for lead‑free assembly.

Typical Applications

• Industrial Control  Implement real‑time control logic, motor control interfaces, and deterministic I/O handling that leverage the device’s industrial temperature rating and large I/O count.
• Signal Processing  Use the extensive logic fabric and embedded RAM for data path acceleration, filtering, and custom DSP pipelines.
• Prototyping and Custom Hardware  Deploy as a platform for hardware prototyping, algorithm validation, and custom accelerators where high logic density and flexible I/O are required.
• Embedded System Integration  Integrate multiple peripheral interfaces and custom state machines directly in the FPGA fabric to reduce external component count.

Unique Advantages

• Large Logic Capacity:  With approximately 82,944 logic elements, the device supports complex designs and substantial parallelism without immediate need for multiple FPGAs.
• On‑Chip Memory:  Nearly 3.54 Mbits of embedded RAM reduce dependence on external memory for buffering and local storage, simplifying board design.
• Extensive I/O Count:  440 I/O pins enable direct connection to a wide range of peripherals, high‑speed interfaces, and wide data buses.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation, the part is suitable for deployments in harsh or wide‑temperature industrial environments.
• High‑Density Packaging:  The 676‑FCBGA (27 × 27 mm) package delivers a compact, soldered solution for high‑pin‑count requirements while supporting surface‑mount assembly.
• Standards‑Friendly Compliance:  RoHS compliance supports lead‑free manufacturing and regulatory requirements for many markets.

Why Choose XC5VLX85-1FF676I?

The XC5VLX85-1FF676I combines a large programmable fabric, substantial embedded memory, and a broad I/O complement in a single industrial‑rated FCBGA package. This combination makes it well suited to designers who need significant on‑chip resources and reliable operation across a wide temperature range.

Ideal for development teams and production designs that require scalable logic capacity, on‑chip buffering, and robust board‑level integration, the device provides a clear platform for consolidating functions and simplifying system architecture while meeting environmental and assembly requirements.

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