XC5VLX85-1FFG676C

The XC5VLX85-1FFG676C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) from AMD. It integrates 82,944 logic elements with approximately 3.54 Mbits of on-chip RAM and provides 440 user I/O in a compact 676‑FCBGA (27×27) package.

Designed for complex digital logic implementations and high-density I/O designs, this commercial-grade, surface-mount FPGA supports a 0.95–1.05 V core voltage range and an operating temperature range of 0 °C to 85 °C, offering a balance of capacity, integration, and manufacturability for demanding embedded applications.

Key Features

• Core Capacity  82,944 logic elements for implementing large-scale digital designs and parallel logic functions.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM to support buffering, lookup tables, and data storage inside the FPGA fabric.
• High‑Density I/O  440 user I/O pins to accommodate wide bus interfaces, multiple signaling channels, and flexible peripheral connections.
• Power  Core supply range of 0.95 V to 1.05 V to match system power-rail requirements and support standard FPGA power domains.
• Package & Mounting  676‑FCBGA (27×27) package in a surface-mount form factor for compact board-level integration.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for temperature-controlled environments.
• Compliance  RoHS‑compliant to meet standard environmental regulations for lead-free manufacturing.

Typical Applications

• High‑density I/O systems  Use the 440 user I/O to interface with multiple parallel buses, front-end controllers, or high-channel-count peripherals.
• Memory‑intensive logic  Leverage approximately 3.54 Mbits of embedded memory for buffering, packet processing, and temporary data storage inside the FPGA.
• Complex digital designs  Deploy the 82,944 logic elements for large combinational and sequential logic blocks, state machines, and custom accelerators.

Unique Advantages

• Substantial logic resources: 82,944 logic elements enable implementation of large and complex digital functions without immediate need for multiple devices.
• On‑chip memory availability: Approximately 3.54 Mbits of embedded RAM reduces external memory dependence and simplifies board-level design.
• Extensive I/O count: 440 user I/O pins support broad interfacing options and reduce the need for additional I/O expanders.
• Compact, manufacturable package: 676‑FCBGA (27×27) surface-mount package supports dense PCB layouts and automated assembly processes.
• Commercial temperature range: 0 °C to 85 °C aligns with general-purpose electronics and system-level thermal designs.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production environments.

Why Choose XC5VLX85-1FFG676C?

The XC5VLX85-1FFG676C positions itself as a high-capacity Virtex‑5 LX FPGA offering a strong balance of logic density, embedded memory, and I/O resources in a single commercial-grade package. Its combination of 82,944 logic elements, approximately 3.54 Mbits of on-chip RAM, and 440 I/O pins makes it suitable for designs that require substantial internal resources and broad interfacing capability.

This device is well suited to engineering teams building medium- to large-scale digital systems that require on-chip memory and high I/O counts while maintaining standard commercial operating conditions and surface-mount board assembly practices. Manufacturer documentation is available for detailed implementation and system integration guidance.

Request a quote or submit an inquiry to get pricing and availability details for the XC5VLX85-1FFG676C.