XC5VLX85-1FFG1153I

The XC5VLX85-1FFG1153I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD designed for designs requiring substantial programmable logic, embedded memory and a high I/O count. It integrates a large number of logic elements and on-chip RAM in a 1153-ball FCBGA package suitable for surface-mount assembly.

With support for a core supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C, the device targets industrial applications that need robust thermal performance and compliance with RoHS requirements.

Key Features

• Logic Capacity  Provides 82,944 logic elements to implement complex digital designs and custom logic functions.
• Embedded Memory  Includes approximately 3.54 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O Density  Up to 560 I/O pins to support wide parallel interfaces and numerous peripheral connections.
• Package & Mounting  Supplied in a 1153-FCBGA (1153-BBGA) package (35×35 mm footprint) for high-density board integration; surface-mount mounting type.
• Power Supply  Core supply voltage range from 0.95 V to 1.05 V to match system power rails and design constraints.
• Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C operation, suitable for temperature-demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• I/O-Intensive Systems  High I/O count (560 pins) supports designs that require broad peripheral connectivity and parallel data paths.
• High-Density Logic Implementations  Large logic capacity (82,944 logic elements) enables complex state machines, packet processing, and custom accelerators.
• Embedded Memory–Dependent Designs  Approximately 3.54 Mbits of on-chip RAM supports buffering, look-up tables, and local data storage without external memory for some functions.
• Industrial Equipment  Industrial temperature rating (−40 °C to 100 °C) and surface-mount FCBGA package make the device appropriate for control and instrumentation applications operating in challenging thermal conditions.

Unique Advantages

• High Logic Density: 82,944 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial On‑Chip RAM: Approximately 3.54 Mbits of embedded memory reduces dependence on external RAM for many buffering and caching needs.
• Large I/O Count: 560 I/Os provide flexibility for connecting many peripherals, sensors, or parallel interfaces without additional I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in thermally demanding industrial environments.
• Compact, High‑Density Package: 1153-FCBGA (35×35) package enables a compact board footprint while supporting high pin count and performance.
• RoHS Compliant: Conforms to RoHS environmental requirements for lead-free assembly and regulatory alignment.

Why Choose XC5VLX85-1FFG1153I?

The XC5VLX85-1FFG1153I positions itself as a high-capacity, industrial-grade FPGA option for systems that require significant programmable logic, embedded memory and extensive I/O in a compact surface-mount package. Its combination of 82,944 logic elements, approximately 3.54 Mbits of on-chip RAM and 560 I/Os makes it well suited to consolidate multiple functions and reduce external component count.

Produced by AMD and supplied in a 1153-FCBGA package with a core voltage range of 0.95 V to 1.05 V and an operating range of −40 °C to 100 °C, the device is aimed at engineers designing robust, high-density digital systems for industrial environments where thermal performance and regulatory compliance are required.

Request a quote or submit an inquiry for availability and pricing for the XC5VLX85-1FFG1153I to evaluate it for your next high-density FPGA design.