XC5VLX85-1FFG1153C

The XC5VLX85-1FFG1153C is an AMD Virtex-5 LX field programmable gate array supplied in a 1153-FCBGA package. It provides substantial on-chip logic and embedded memory density along with a large number of user I/O, making it suitable for complex board-level digital designs that require significant integration.

This commercial-grade, surface-mount FPGA is intended for designs that need extensive logic resources, approximately 3.5 Mbits of embedded RAM, and up to 560 user I/O pins, while operating within a 0 °C to 85 °C temperature range and a 0.95 V to 1.05 V core supply window.

Key Features

• Core Logic — 82,944 logic elements provide a large fabric for implementing custom digital logic, state machines, and datapaths.
• Configurable Logic Blocks — Significant block count enables partitioned designs and high levels of parallelism for compute-intensive tasks.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM to support buffers, FIFOs, and embedded data storage without external memory in many use cases.
• I/O Density — Up to 560 user I/O pins to connect with sensors, peripherals, high-pin-count interfaces, and board-level routing requirements.
• Package and Mounting — Available in a 1153-FCBGA (35×35) package, supplied as a surface-mount device for high-density PCB assembly.
• Power and Temperature — Core voltage support from 950 mV to 1.05 V and an operating temperature range of 0 °C to 85 °C, aligned with commercial-grade system requirements.
• Compliance — RoHS compliant to meet modern assembly and environmental requirements.

Typical Applications

• High-density I/O systems — Use the 560 user I/O pins to interface large connector arrays, multi-channel data acquisition, or dense sensor networks.
• Embedded memory-intensive designs — Leverage approximately 3.5 Mbits of on-chip RAM for buffering, packet handling, and temporary data storage without relying solely on external memory.
• Custom digital processing — Implement application-specific datapaths, protocol engines, or control logic using the available 82,944 logic elements.
• Board-level FPGA integration — The 1153-FCBGA surface-mount package supports compact PCB designs and high-pin-count routing for embedded systems.

Unique Advantages

• Extensive logic capacity: 82,944 logic elements enable complex implementations and increased functional integration on a single device.
• On-chip memory: Approximately 3.5 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage tasks.
• High I/O count: 560 user I/Os simplify connectivity to multiple peripherals and high-density interfaces, reducing board-level multiplexing.
• Surface-mount FCBGA package: The 1153-FCBGA (35×35) package supports compact PCB layouts and reliable assembly for production designs.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose XC5VLX85-1FFG1153C?

The XC5VLX85-1FFG1153C combines a large logic fabric, substantial embedded RAM, and a high I/O count within a compact FCBGA package, offering an integrated solution for complex digital and embedded designs. Its commercial-grade rating and RoHS compliance make it suitable for production systems that require reliable, high-density FPGA resources.

This device is a good fit for engineering teams building board-level systems that need significant on-chip logic and memory capacity, and it benefits designs that prioritize integration and I/O density while adhering to a 0 °C to 85 °C operating range and a 0.95 V–1.05 V core supply requirement.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX85-1FFG1153C and to discuss how it can be applied in your design.