XC5VLX85-1FF676C
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA |
|---|---|
| Quantity | 534 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 440 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6480 | Number of Logic Elements/Cells | 82944 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC5VLX85-1FF676C – Virtex-5 LX FPGA, 676‑FCBGA (27×27)
The XC5VLX85-1FF676C is a Virtex-5 LX field programmable gate array (FPGA) from AMD designed for commercial applications. It provides a large logic fabric, significant on-chip RAM, and extensive I/O count for designs that require high integration of digital logic and interfacing.
With 82,944 logic elements, approximately 3.54 Mbits of embedded memory and 440 I/O pins, this surface-mount FPGA supports dense logic implementations while operating within a supply range of 950 mV to 1.05 V and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core Logic 82,944 logic elements provide substantial programmable fabric for implementing complex custom logic and control functions.
- Embedded Memory Approximately 3.54 Mbits of on-chip RAM for buffering, lookup tables and state storage directly inside the device.
- I/O Density 440 user I/O pins to support high-pin-count interfacing and multiple peripheral connections.
- Power and Supply Operates with a supply voltage range from 950 mV to 1.05 V, enabling compatibility with low-voltage core power domains.
- Package and Mounting Available in a 676‑FCBGA (27×27) surface-mount package; package case is listed as 676‑BBGA, FCBGA to support compact board layouts.
- Operating Conditions Commercial grade device specified for operation from 0 °C to 85 °C.
- Compliance RoHS compliant to support lead-free assembly processes.
Typical Applications
- Custom Logic Acceleration Use the large logic element count to implement application‑specific hardware accelerators and protocol offloads.
- Digital Signal Processing On-chip RAM and abundant logic resources support buffering and parallel DSP pipelines for real-time processing.
- High-Density I/O Control 440 I/Os enable broad sensor, peripheral and bus interfacing for complex system control and data aggregation tasks.
Unique Advantages
- High Logic Capacity: 82,944 logic elements let you consolidate multiple functions into a single FPGA, reducing component count and PCB complexity.
- Integrated Memory Resource: Approximately 3.54 Mbits of embedded RAM enables local data storage and lowers external memory needs for many designs.
- Extensive I/O: 440 I/O pins provide flexibility to connect to a wide range of peripherals and interfaces without additional multiplexing hardware.
- Compact Surface-Mount Package: 676‑FCBGA (27×27) packaging supports dense board integration while preserving routing options for high-pin-count designs.
- Commercial-Grade Operation: Specified for 0 °C to 85 °C operation, suitable for a broad set of commercial and industrial-adjacent environments.
- Regulatory Compliance: RoHS compliance helps streamline lead-free manufacturing and regulatory alignment.
Why Choose XC5VLX85-1FF676C?
The XC5VLX85-1FF676C positions itself as a high‑capacity, commercially graded FPGA option for engineers who need substantial programmable logic, embedded memory and high I/O density in a single surface-mount package. Its combination of 82,944 logic elements, approximately 3.54 Mbits of on-chip RAM and 440 I/Os makes it well-suited to designs requiring consolidated digital processing and interfacing.
This device is appropriate for teams building robust, scalable digital solutions that benefit from integrated memory and dense I/O while remaining within standard commercial temperature and supply domains. RoHS compliance and the 676‑FCBGA packaging support modern assembly and compact board designs.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for the XC5VLX85-1FF676C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








