XC5VLX85-1FF676C

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA

Quantity 534 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6480Number of Logic Elements/Cells82944
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC5VLX85-1FF676C – Virtex-5 LX FPGA, 676‑FCBGA (27×27)

The XC5VLX85-1FF676C is a Virtex-5 LX field programmable gate array (FPGA) from AMD designed for commercial applications. It provides a large logic fabric, significant on-chip RAM, and extensive I/O count for designs that require high integration of digital logic and interfacing.

With 82,944 logic elements, approximately 3.54 Mbits of embedded memory and 440 I/O pins, this surface-mount FPGA supports dense logic implementations while operating within a supply range of 950 mV to 1.05 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic  82,944 logic elements provide substantial programmable fabric for implementing complex custom logic and control functions.
  • Embedded Memory  Approximately 3.54 Mbits of on-chip RAM for buffering, lookup tables and state storage directly inside the device.
  • I/O Density  440 user I/O pins to support high-pin-count interfacing and multiple peripheral connections.
  • Power and Supply  Operates with a supply voltage range from 950 mV to 1.05 V, enabling compatibility with low-voltage core power domains.
  • Package and Mounting  Available in a 676‑FCBGA (27×27) surface-mount package; package case is listed as 676‑BBGA, FCBGA to support compact board layouts.
  • Operating Conditions  Commercial grade device specified for operation from 0 °C to 85 °C.
  • Compliance  RoHS compliant to support lead-free assembly processes.

Typical Applications

  • Custom Logic Acceleration  Use the large logic element count to implement application‑specific hardware accelerators and protocol offloads.
  • Digital Signal Processing  On-chip RAM and abundant logic resources support buffering and parallel DSP pipelines for real-time processing.
  • High-Density I/O Control  440 I/Os enable broad sensor, peripheral and bus interfacing for complex system control and data aggregation tasks.

Unique Advantages

  • High Logic Capacity: 82,944 logic elements let you consolidate multiple functions into a single FPGA, reducing component count and PCB complexity.
  • Integrated Memory Resource: Approximately 3.54 Mbits of embedded RAM enables local data storage and lowers external memory needs for many designs.
  • Extensive I/O: 440 I/O pins provide flexibility to connect to a wide range of peripherals and interfaces without additional multiplexing hardware.
  • Compact Surface-Mount Package: 676‑FCBGA (27×27) packaging supports dense board integration while preserving routing options for high-pin-count designs.
  • Commercial-Grade Operation: Specified for 0 °C to 85 °C operation, suitable for a broad set of commercial and industrial-adjacent environments.
  • Regulatory Compliance: RoHS compliance helps streamline lead-free manufacturing and regulatory alignment.

Why Choose XC5VLX85-1FF676C?

The XC5VLX85-1FF676C positions itself as a high‑capacity, commercially graded FPGA option for engineers who need substantial programmable logic, embedded memory and high I/O density in a single surface-mount package. Its combination of 82,944 logic elements, approximately 3.54 Mbits of on-chip RAM and 440 I/Os makes it well-suited to designs requiring consolidated digital processing and interfacing.

This device is appropriate for teams building robust, scalable digital solutions that benefit from integrated memory and dense I/O while remaining within standard commercial temperature and supply domains. RoHS compliance and the 676‑FCBGA packaging support modern assembly and compact board designs.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the XC5VLX85-1FF676C.

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