XC5VLX85-1FFG676I

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA

Quantity 345 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6480Number of Logic Elements/Cells82944
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC5VLX85-1FFG676I – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC, 440 I/O, 676-FCBGA

The XC5VLX85-1FFG676I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD delivering a high-density programmable logic fabric in a compact ball-grid array package. It combines a large logic capacity with embedded memory and a substantial I/O count to support complex, reconfigurable digital designs.

This device provides 82,944 logic elements, approximately 3.54 Mbits of embedded memory and 440 I/O pins in a 676-FCBGA (27×27) surface-mount package, operating from 950 mV to 1.05 V and rated for an industrial temperature range of -40 °C to 100 °C.

Key Features

  • Core Logic  82,944 logic elements provide a large, flexible programmable fabric for implementing custom digital logic and parallel processing functions.
  • Embedded Memory  Approximately 3.54 Mbits of on-chip RAM support buffering, lookup tables and state storage for complex designs.
  • I/O Density  440 I/O pins enable high device connectivity for interfacing to multiple peripherals, buses and high-density connectors.
  • Package and Mounting  Delivered in a 676-FCBGA (676-BBGA) 27×27 surface-mount package to accommodate high-pin-count board layouts.
  • Power Supply  Core voltage range specified from 950 mV to 1.05 V to match system power-rail requirements.
  • Operating Temperature  Industrial temperature rating from -40 °C to 100 °C for deployment in temperature-variable environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Reconfigurable logic and custom processing  Use the large logic element count to implement custom compute pipelines, protocol processing or hardware accelerators.
  • Memory-centric designs  On-chip embedded memory supports buffering, packet handling and data staging within systems that require local storage.
  • High-density I/O aggregation  With 440 I/O pins, the device can consolidate multiple interfaces and peripheral connections on a single FPGA.
  • Industrial and temperature-challenging systems  Industrial-grade operating range (-40 °C to 100 °C) fits applications exposed to extended temperature variations.

Unique Advantages

  • Large programmable fabric: 82,944 logic elements enable complex designs and significant parallelism without external logic.
  • Integrated on-chip memory: Approximately 3.54 Mbits of embedded RAM reduces dependence on external memory for latency-sensitive functions.
  • High I/O capacity: 440 I/O pins simplify board-level routing and reduce the need for additional interfacing devices.
  • Industrial rating: Specified -40 °C to 100 °C operation supports deployment in industrial environments.
  • Space-efficient package: 676-FCBGA (27×27) surface-mount package supports high-pin-count designs in a compact footprint.
  • RoHS compliant: Conforms to environmental regulatory requirements for lead-free manufacturing processes.

Why Choose XC5VLX85-1FFG676I?

The XC5VLX85-1FFG676I offers a combination of high logic capacity, embedded memory and extensive I/O in a single industrial-grade FPGA package, making it suitable for designs that require substantial on-chip resources and robust environmental tolerance. Its specified voltage and temperature ranges, along with a high-density 676-FCBGA package, allow designers to integrate complex functionality while addressing board-space and connectivity constraints.

This device is well suited for engineering teams building reconfigurable systems that need scalable logic, internal memory for buffering and a large number of external interfaces. The AMD Virtex-5 LX offering provides a platform-oriented choice for long-life designs where programmability and on-chip integration reduce external BOM and simplify system architecture.

Request a quote or submit an RFQ to receive pricing and availability information for the XC5VLX85-1FFG676I.

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