XC5VLX85-1FFG676I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA |
|---|---|
| Quantity | 345 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 440 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6480 | Number of Logic Elements/Cells | 82944 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC5VLX85-1FFG676I – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC, 440 I/O, 676-FCBGA
The XC5VLX85-1FFG676I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD delivering a high-density programmable logic fabric in a compact ball-grid array package. It combines a large logic capacity with embedded memory and a substantial I/O count to support complex, reconfigurable digital designs.
This device provides 82,944 logic elements, approximately 3.54 Mbits of embedded memory and 440 I/O pins in a 676-FCBGA (27×27) surface-mount package, operating from 950 mV to 1.05 V and rated for an industrial temperature range of -40 °C to 100 °C.
Key Features
- Core Logic 82,944 logic elements provide a large, flexible programmable fabric for implementing custom digital logic and parallel processing functions.
- Embedded Memory Approximately 3.54 Mbits of on-chip RAM support buffering, lookup tables and state storage for complex designs.
- I/O Density 440 I/O pins enable high device connectivity for interfacing to multiple peripherals, buses and high-density connectors.
- Package and Mounting Delivered in a 676-FCBGA (676-BBGA) 27×27 surface-mount package to accommodate high-pin-count board layouts.
- Power Supply Core voltage range specified from 950 mV to 1.05 V to match system power-rail requirements.
- Operating Temperature Industrial temperature rating from -40 °C to 100 °C for deployment in temperature-variable environments.
- Regulatory RoHS compliant.
Typical Applications
- Reconfigurable logic and custom processing Use the large logic element count to implement custom compute pipelines, protocol processing or hardware accelerators.
- Memory-centric designs On-chip embedded memory supports buffering, packet handling and data staging within systems that require local storage.
- High-density I/O aggregation With 440 I/O pins, the device can consolidate multiple interfaces and peripheral connections on a single FPGA.
- Industrial and temperature-challenging systems Industrial-grade operating range (-40 °C to 100 °C) fits applications exposed to extended temperature variations.
Unique Advantages
- Large programmable fabric: 82,944 logic elements enable complex designs and significant parallelism without external logic.
- Integrated on-chip memory: Approximately 3.54 Mbits of embedded RAM reduces dependence on external memory for latency-sensitive functions.
- High I/O capacity: 440 I/O pins simplify board-level routing and reduce the need for additional interfacing devices.
- Industrial rating: Specified -40 °C to 100 °C operation supports deployment in industrial environments.
- Space-efficient package: 676-FCBGA (27×27) surface-mount package supports high-pin-count designs in a compact footprint.
- RoHS compliant: Conforms to environmental regulatory requirements for lead-free manufacturing processes.
Why Choose XC5VLX85-1FFG676I?
The XC5VLX85-1FFG676I offers a combination of high logic capacity, embedded memory and extensive I/O in a single industrial-grade FPGA package, making it suitable for designs that require substantial on-chip resources and robust environmental tolerance. Its specified voltage and temperature ranges, along with a high-density 676-FCBGA package, allow designers to integrate complex functionality while addressing board-space and connectivity constraints.
This device is well suited for engineering teams building reconfigurable systems that need scalable logic, internal memory for buffering and a large number of external interfaces. The AMD Virtex-5 LX offering provides a platform-oriented choice for long-life designs where programmability and on-chip integration reduce external BOM and simplify system architecture.
Request a quote or submit an RFQ to receive pricing and availability information for the XC5VLX85-1FFG676I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








