XC5VLX85-2FF676I

The XC5VLX85-2FF676I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 676-FCBGA (27×27) package. It provides a substantial logic resource set and embedded memory in an industrial-grade, surface-mount form factor for board-level integration.

With 6,480 configurable logic blocks (CLBs), 82,944 logic elements, approximately 3.54 Mbits of on-chip RAM, and 440 I/O pins, this device targets designs that require high logic capacity, significant embedded memory, and a large I/O footprint within a compact BGA package.

Key Features

• Core Logic  6,480 configurable logic blocks (CLBs) and 82,944 logic element cells provide the primary programmable fabric for custom digital logic implementations.
• Embedded Memory  Approximately 3.54 Mbits of total on-chip RAM to support buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Capacity  440 I/O pins allow for broad interfacing options to external devices, buses, and peripherals.
• Power Supply  Core voltage supply range of 0.950 V to 1.05 V for the device core power domain.
• Package & Mounting  676-FCBGA package (27×27) designed for surface-mount PCB assembly, providing a high-density physical footprint.
• Operating Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance  RoHS-compliant status for environmental material compliance.

Unique Advantages

• High Logic Capacity: 82,944 logic element cells enable complex custom logic and large-scale digital designs without external ASICs.
• Significant On-Chip Memory: Approximately 3.54 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage tasks.
• Extensive I/O Count: 440 I/O pins support wide parallel interfaces and multiple peripheral connections from a single device.
• Industrial Temperature Rating: −40 °C to 100 °C operating range supports use in applications exposed to wide thermal extremes.
• Compact High-Density Package: 676-FCBGA (27×27) offers a dense, surface-mount solution for space-constrained boards.
• Regulatory Compliance: RoHS compliance helps meet environmental material requirements for regulated products.

Why Choose XC5VLX85-2FF676I?

The XC5VLX85-2FF676I combines a large logic fabric, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount 676-FCBGA package. Its documented electrical and environmental specifications — including a 0.950–1.05 V core supply range and −40 °C to 100 °C operating temperature — make it suitable for designs that require verifiable core voltage and thermal operating limits.

This FPGA is appropriate for engineering teams and procurement sourcing devices that need clear, measurable resources: CLB count, logic element capacity, on-chip RAM, I/O density, and a specific package footprint. Specifying this part supports designs where those attributes are primary selection criteria.

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