XC5VLX85-2FFG676I

IC FPGA 440 I/O 676FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA

Quantity 617 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O440Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6480Number of Logic Elements/Cells82944
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3538944

Overview of XC5VLX85-2FFG676I – Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA

The XC5VLX85-2FFG676I is a Virtex®-5 LX field programmable gate array designed for industrial applications requiring large, configurable logic resources and abundant I/O. It provides a dense logic fabric and embedded RAM to implement complex custom logic, control, and interfacing functions.

Key hardware characteristics include approximately 82,944 logic elements, roughly 3.54 Mbits of on-chip RAM, 440 user I/O pins, and a 676-ball FCBGA package. The device operates from a core supply of 0.95 V to 1.05 V and supports an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity — Approximately 82,944 logic elements for implementing large-scale custom logic, state machines, and datapaths.
  • Embedded Memory — Approximately 3.54 Mbits of on-chip RAM to support buffers, FIFOs, and distributed memory structures without external devices.
  • I/O Density — 440 user I/O pins to support extensive peripheral interfacing, parallel buses, and multi-channel connectivity.
  • Package & Mounting — 676-ball FCBGA (27 × 27) package in a surface-mount form factor for compact board-level integration.
  • Core Power — Core voltage supply range of 0.95 V to 1.05 V to meet system power-plan requirements.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Control — Implement motion control, PLC logic, and machine automation functions leveraging the device’s logic density and industrial temperature rating.
  • Data Acquisition & I/O Aggregation — Aggregate and condition signals from many sensors or interfaces using the high I/O count and embedded RAM for buffering.
  • Custom Logic Acceleration — Offload compute-intensive or latency-sensitive functions to programmable fabric using the large number of logic elements and on-chip memory.
  • Embedded System Prototyping — Validate complex hardware architectures and system-level integrations on a single programmable device with extensive I/O.

Unique Advantages

  • High-density programmable fabric: Approximately 82,944 logic elements enable implementation of large, feature-rich designs on a single device, reducing BOM count.
  • Substantial embedded memory: Around 3.54 Mbits of on-chip RAM supports local buffering and memory-intensive functions without immediate reliance on external memory.
  • Wide I/O capability: 440 I/O pins provide flexibility for multiple interfaces, parallel buses, and high-channel-count systems.
  • Industrial-grade operation: Specified for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
  • Compact FCBGA package: 676-ball FCBGA (27 × 27) surface-mount package enables dense board layouts while maintaining robust connectivity.
  • Low-voltage core operation: Core supply from 0.95 V to 1.05 V supports modern low-voltage power architectures.

Why Choose XC5VLX85-2FFG676I?

The XC5VLX85-2FFG676I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex-5 LX family, offering a combination of large logic resources, significant on-chip RAM, and abundant I/O in a compact FCBGA package. Its temperature rating and surface-mount form factor make it suitable for demanding embedded and industrial applications that require robust, configurable silicon.

This device is well suited for engineers and teams building systems that need extensive programmable logic, local memory, and multi-channel interfacing while operating across a wide temperature range. Its specification set supports designs that prioritize integration, board-level density, and predictable power requirements.

Request a quote or submit an inquiry to purchase the XC5VLX85-2FFG676I and discuss availability and lead times.

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