XC5VLX85-3FFG676C

The XC5VLX85-3FFG676C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) from AMD. It delivers substantial on-chip logic capacity and memory in a 676-FCBGA surface-mount package for commercial-grade designs.

Key attributes include approximately 82,944 logic elements, approximately 3.54 Mbits of embedded RAM, and 440 general-purpose I/O pins, together supporting high-density logic implementations with significant on-chip memory and interface capacity.

Key Features

• Logic Capacity Approximately 82,944 logic elements to implement complex digital logic and custom datapaths.
• Embedded Memory Approximately 3.54 Mbits of on-chip RAM (3,538,944 bits) for buffering, FIFOs, and local data storage.
• I/O Resources 440 I/O pins to support wide parallel interfaces and multiple external connections.
• Power Core voltage supply range of 950 mV to 1.05 V for device operation.
• Package & Mounting 676-FCBGA (27×27) package in a surface-mount form factor, suitable for compact board-level integration.
• Temperature & Grade Commercial operating temperature range of 0 °C to 85 °C; designated as Commercial grade.
• Environmental Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density logic systems — Implement complex, large-scale logic functions using the device's approximately 82,944 logic elements.
• Memory-centric designs — Leverage approximately 3.54 Mbits of embedded RAM for buffering, packet memory, or local storage needs.
• I/O-intensive interfaces — Connect multiple peripherals and parallel interfaces using the device's 440 I/O pins.
• Compact board-level solutions — Integrate into space-constrained designs with the 676-FCBGA (27×27) surface-mount package.

Unique Advantages

• High logic density: Approximately 82,944 logic elements enable implementation of complex digital designs without immediate escalation to larger devices.
• Substantial on-chip RAM: Approximately 3.54 Mbits of embedded memory reduces dependence on external memory for many applications.
• Extensive I/O count: 440 I/Os support wide parallel data paths and multiple external interfaces, simplifying system-level connectivity.
• Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package facilitates high-density PCB layouts and standard assembly processes.
• Commercial temperature rating: Rated 0 °C to 85 °C to align with a wide range of commercial electronic applications.
• RoHS compliant: Meets RoHS requirements for reduced hazardous substances in manufacturing.

Why Choose XC5VLX85-3FFG676C?

The XC5VLX85-3FFG676C positions itself as a high-capacity, memory-rich Virtex®-5 LX FPGA option for commercial designs that require significant logic resources, on-chip RAM, and extensive I/O in a compact FCBGA package. Its combination of logic density, embedded memory, and I/O flexibility makes it suitable for demanding digital systems where board space and integration matter.

Designed and supplied by AMD, this device provides a balance of performance-oriented resources and practical packaging for customers seeking scalability within the Virtex-5 product family and a device compliant with RoHS requirements.

Request a quote or submit an inquiry for the XC5VLX85-3FFG676C to begin the procurement process or to receive pricing and availability information.