XC5VLX85T-1FFG1136C

The XC5VLX85T-1FFG1136C is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC from AMD offered in a high-pin-count FCBGA package. It delivers high logic capacity, substantial on-chip memory, and broad I/O connectivity in a surface-mount commercial-grade package.

Designed for designs that require large numbers of logic elements, on-chip embedded memory, and many I/O signals, this device supports integration of complex digital functions while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Capacity  82,944 logic elements to implement complex digital logic and high-density designs.
• Embedded Memory  Approximately 3.98 Mbits of on-chip RAM for buffering, FIFOs, and local storage needs.
• I/O Density  480 available I/O pins to support wide external interfacing and parallel connectivity.
• Power Supply  Supported core voltage range from 950 mV to 1.05 V for core power planning and supply design.
• Package and Mounting  1136-FCBGA (35×35 mm) package case in a surface-mount form factor for compact, high-pin-count board layouts.
• Operating Range & Compliance  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant for environmental requirements.

Typical Applications

• High-density digital processing  Implement complex logic blocks and data-paths using the device's large number of logic elements and on-chip RAM.
• Multi-channel I/O systems  Leverage 480 I/O pins to connect multiple peripherals, sensors, or parallel interfaces in a single FPGA solution.
• Embedded system integration  Combine processing, buffering, and interfacing functions on-chip to reduce external component count and simplify designs.

Unique Advantages

• High logic density: 82,944 logic elements enable implementation of sizable digital designs without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 3.98 Mbits of on-chip RAM supports local data storage and streaming use cases.
• Extensive I/O connectivity: 480 I/O pins provide flexibility for complex interconnect and multi-interface designs.
• Compact high-pin package: 1136-FCBGA (35×35) package delivers high pin count in a space-efficient surface-mount footprint.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications and regulatory considerations.

Why Choose XC5VLX85T-1FFG1136C?

The XC5VLX85T-1FFG1136C positions itself as a high-capacity, integration-focused FPGA that combines tens of thousands of logic elements, several megabits of embedded RAM, and a large I/O complement in a single 1136-FCBGA surface-mount package. Its electrical and thermal specifications support commercial-grade deployments where dense logic implementation and significant on-chip memory are required.

This device is well suited for engineers and procurement teams developing systems that benefit from consolidated digital logic, extensive external connectivity, and a compact board-level footprint while maintaining conformity with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VLX85T-1FFG1136C.