XC5VLX85T-2FF1136I

The XC5VLX85T-2FF1136I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) from AMD, supplied in a 1136-ball FCBGA package. It provides a high-density programmable fabric with a large number of logic cells, substantial embedded memory, and extensive I/O capability for demanding system-level integration.

Designed for industrial-grade deployments, this device targets applications that require significant logic capacity, many I/O connections, and broad operating temperature tolerance while operating from a low-voltage core supply.

Key Features

• Logic Capacity  Contains 82,944 logic cells and 6,480 logic blocks to implement complex digital designs and multi-function systems.
• Embedded Memory  Approximately 3.98 Mbits of embedded memory (3,981,312 total RAM bits) for on-chip buffering, state storage, and local data processing.
• I/O Resources  480 user I/O pins provide extensive external interfacing for peripherals, sensors, and parallel connectivity.
• Package and Mounting  Available in an 1136-ball BGA (1136-FCBGA, 35×35 mm) package with surface-mount mounting suitable for board-level assemblies.
• Power  Core supply range from 0.95 V to 1.05 V to match low-voltage system domains and power architectures.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for use in temperature-variable environments.
• Compliance  RoHS compliant, addressing environmental and material requirements for assemblies.

Typical Applications

• High-density digital systems  Use the device's large logic capacity and embedded memory to implement complex state machines, protocol stacks, and custom accelerators.
• Multi-I/O interface hubs  480 I/O pins enable dense peripheral interfacing, board-level consolidation, and flexible connectivity for mixed-signal systems.
• Industrial control and automation  Industrial-grade temperature range and robust packaging support deployment in factory automation and process-control systems that require reliable operation across temperatures.

Unique Advantages

• High programmable density: With 82,944 logic cells, the device supports large, integrated designs that reduce external component count.
• Substantial on-chip memory: Approximately 3.98 Mbits of embedded memory enable localized data storage and buffering to improve system responsiveness.
• Extensive external connectivity: 480 I/O pins provide the flexibility to connect multiple peripherals and interfaces without additional bridge logic.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support deployment in temperature-variable industrial environments.
• Compact, board-ready package: 1136-FCBGA (35×35 mm) surface-mount package simplifies PCB layout for high-density systems.
• RoHS compliant: Meets lead-free material requirements for environmentally conscious assemblies.

Why Choose XC5VLX85T-2FF1136I?

The XC5VLX85T-2FF1136I combines substantial logic resources, several megabits of embedded memory, and hundreds of I/O to address complex digital designs that require high integration. Its industrial temperature rating and industry-standard FCBGA package make it suitable for durable, board-level implementations where density and connectivity are priorities.

This FPGA is well suited to engineering teams and procurement organizations building scalable, rugged systems that benefit from on-chip memory, many logic cells, and broad I/O—offering a balance of integration, configurability, and environmental tolerance.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and lead times for the XC5VLX85T-2FF1136I.