XC5VLX85T-3FF1136C

The XC5VLX85T-3FF1136C is a Virtex®-5 LXT field programmable gate array (FPGA) from AMD, offered in a 1136-ball FCBGA package. It provides a high-density programmable logic fabric with 82,944 logic elements, approximately 3.98 Mbits of embedded RAM, and 480 general-purpose I/O connections for complex digital designs.

Designed for surface-mount assembly and commercial temperature operation (0 °C to 85 °C), this device targets applications that require substantial on-chip logic, memory, and I/O capability within a compact 35 × 35 mm package. The core supply voltage range is specified at 0.95 V to 1.05 V.

Key Features

• Core Logic — 82,944 logic elements provide a large, configurable logic resource for implementing complex digital functions and custom processing pipelines.
• Embedded Memory — Approximately 3.98 Mbits of on-chip RAM to support buffering, packet processing, and intermediate data storage without external memory in some use cases.
• I/O Capacity — 480 I/O pins enable extensive interfacing to peripherals, sensors, high-speed links, and system buses.
• Power Supply — Core voltage specified from 0.95 V to 1.05 V to match platform power-rail requirements.
• Package & Mounting — 1136-FCBGA (35 × 35 mm) package in a surface-mount form factor for compact board-level integration.
• Operating Conditions — Commercial grade device rated for 0 °C to 85 °C operation.
• Device Scale — Large resource counts suitable for designs requiring high integration of logic, memory, and I/O in a single FPGA.

Typical Applications

• Prototyping and Custom Logic Acceleration — High logic density and on-chip RAM make this device suitable for prototyping complex digital systems and accelerating custom algorithms in hardware.
• High-density DSP and Data Processing — Substantial embedded memory and logic resources support packet processing, signal processing blocks, and real-time data manipulation.
• Networking and Interface Bridging — 480 I/Os provide flexibility for implementing multi-channel interfaces, protocol bridging, and system-level I/O aggregation.
• Embedded System Control — Compact FCBGA package and surface-mount mounting allow integration into space-constrained embedded platforms requiring significant programmable logic.

Unique Advantages

• High logic density: 82,944 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 3.98 Mbits of embedded RAM supports buffering and state storage without immediate dependence on external memory.
• Extensive I/O count: 480 I/Os offer broad connectivity options for complex system interfacing and multi-channel designs.
• Compact, manufacturable package: 1136-FCBGA (35 × 35 mm) surface-mount package enables high-density layouts while maintaining assembly compatibility.
• Defined core voltage range: 0.95 V to 1.05 V specification simplifies power-rail planning for the FPGA core.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet standard temperature environment requirements.

Why Choose XC5VLX85T-3FF1136C?

The XC5VLX85T-3FF1136C is positioned for designers who need a high-density Virtex®-5 LXT FPGA with a large logic fabric, significant embedded memory, and extensive I/O in a compact FCBGA package. Its combination of resources supports integrated, high-performance digital designs where consolidation of multiple functions onto a single device reduces system complexity.

This commercial-grade FPGA is well suited to projects that require scalable programmable logic, on-chip RAM for intermediate data handling, and a high pin count for system interfacing — offering a practical balance of integration and board-level compactness for production and development use.

Request a quote or submit an inquiry for pricing and availability of the XC5VLX85T-3FF1136C to evaluate it for your next design.