XC5VSX240T-1FF1738I

IC FPGA 960 I/O 1738FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 960 19021824 239616 1738-BBGA, FCBGA

Quantity 1,034 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1738-BBGA, FCBGANumber of I/O960Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18720Number of Logic Elements/Cells239616
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19021824

Overview of XC5VSX240T-1FF1738I – Virtex®-5 SXT Field Programmable Gate Array (FPGA)

The XC5VSX240T-1FF1738I is a Virtex-5 SXT field programmable gate array offered in a 1738-ball FCBGA package. It delivers a combination of high logic density, substantial on-chip memory, and a large I/O count for complex, I/O-rich designs.

Designed for industrial-grade use, this device supports a wide operating temperature range and a low-voltage core supply, making it suitable for systems that require significant programmable logic capacity and robust thermal performance.

Key Features

  • Logic Capacity  Approximately 239,616 logic elements provide high-density programmable logic resources for complex implementations.
  • Embedded Memory  Approximately 19.02 Mbits of on-chip RAM to support buffering, state retention, and data path storage.
  • I/O Count  960 general-purpose I/O pins to support extensive external device interfacing and parallel connectivity.
  • Power  Core voltage supply range of 950 mV to 1.05 V to match system power-rail design and enable standard core-voltage operation.
  • Thermal and Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
  • Package and Mounting  1738-FCBGA package (42.5 × 42.5 mm) in surface-mount form factor for compact board-level integration.
  • Manufacturing Compliance  RoHS compliant, supporting environmental and regulatory considerations in assembly.

Typical Applications

  • High-density logic systems  Implement complex state machines, datapaths, and custom logic functions using approximately 239,616 logic elements.
  • I/O-intensive platforms  Support extensive external interfacing and parallel data streams with 960 I/O pins.
  • Memory-dependent processing  Use approximately 19.02 Mbits of embedded memory for buffering, FIFOs, and on-chip storage.
  • Industrial equipment  Deploy in systems that require operation across -40 °C to 100 °C with industrial-grade qualification.

Unique Advantages

  • High programmable density: The device’s approximately 239,616 logic elements enable implementation of large, integrated logic designs without resorting to multiple FPGAs.
  • Substantial on-chip memory: Approximately 19.02 Mbits of RAM reduce dependence on external memory for many buffering and state-holding needs.
  • Extensive I/O resources: 960 I/O pins allow direct interfacing to numerous peripherals and parallel data interfaces, simplifying board-level routing.
  • Industrial temperature rating: Rated from -40 °C to 100 °C for reliable operation in temperature-challenging deployments.
  • Compact FCBGA package: 1738-ball FCBGA (42.5 × 42.5 mm) provides a high-pin-count solution in a surface-mount footprint for space-constrained PCBs.
  • Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose XC5VSX240T-1FF1738I?

The XC5VSX240T-1FF1738I combines a high logic element count, substantial embedded memory, and a very large I/O complement in a single industrial-grade FCBGA package. This balance of resources is well suited to designs that need consolidated programmable logic capacity with broad external connectivity while maintaining rugged operating temperature capability.

As a member of the Virtex-5 SXT family, the device provides a scalable option for engineers and procurement teams seeking a high-density FPGA solution that aligns with industrial environmental requirements and compact board-level packaging.

Request a quote or submit an inquiry for availability and pricing for XC5VSX240T-1FF1738I to begin integrating this device into your design and procurement plans.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up