XC5VSX240T-1FFG1738I

The XC5VSX240T-1FFG1738I is a Virtex-5 SXT field programmable gate array manufactured by AMD. It is supplied in a 1738-ball FCBGA surface-mount package (42.5 × 42.5 mm) and is intended for industrial applications.

The device provides 239,616 logic elements, approximately 19.0 Mbits of embedded memory, and 960 I/O pins. It operates from a core supply of 0.95 V to 1.05 V and is rated for operation from −40 °C to 100 °C.

Key Features

• Core Logic 239,616 logic elements offer extensive programmable logic resources for complex implementations; the device also lists 18,720 CLBs.
• Embedded Memory Approximately 19.0 Mbits of on-chip RAM for buffering, lookup tables and state retention.
• I/O Resources 960 I/O pins support broad system interfacing and signal routing requirements.
• Power Core voltage specification of 0.95 V to 1.05 V for device operation.
• Package 1738-FCBGA (42.5 × 42.5 mm) surface-mount package suitable for compact board-level integration.
• Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• Telecommunications Infrastructure Implement protocol engines, packet processing and wide I/O interfacing using the device’s large logic and I/O resources.
• Industrial Control Use in motor control, factory automation and PLC systems where industrial temperature range and substantial on-chip resources are required.
• Test and Measurement Deploy for data acquisition and signal processing tasks that benefit from abundant embedded memory and programmable logic.

Unique Advantages

• Large Programmable Fabric: 239,616 logic elements enable implementation of complex, parallelized designs.
• Substantial On-Chip Memory: Approximately 19.0 Mbits of embedded RAM reduces dependence on external memory components.
• High I/O Count: 960 I/O pins allow extensive interfacing without additional I/O expanders.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for operation in challenging environments.
• Surface-Mount FCBGA Package: 1738-ball FCBGA (42.5 × 42.5 mm) enables dense board layouts and surface-mount assembly.
• Manufacturer: Produced by AMD.

Why Choose XC5VSX240T-1FFG1738I?

The XC5VSX240T-1FFG1738I is positioned for designs that require a large programmable fabric combined with significant on-chip memory and broad I/O capacity, all within a surface-mount FCBGA package. Its industrial temperature rating and defined core supply range make it suitable for deployments needing temperature resilience and stable power characteristics.

This device is appropriate for engineers and procurement teams developing telecommunications, industrial control, and test/measurement systems that must balance logic density, embedded memory, and extensive I/O in a board-level, surface-mount form factor.

Request a quote or submit an inquiry to source XC5VSX240T-1FFG1738I for your next design project.