XC5VLX85-3FFG1153C

The XC5VLX85-3FFG1153C is a Virtex®-5 LX field programmable gate array (FPGA) IC from AMD, supplied in a 1153-FCBGA package. It delivers a high count of programmable logic and on-chip memory along with a large I/O complement for designs that require dense digital logic and extensive external connectivity.

Key attributes include 82,944 logic elements, approximately 3.54 Mbits of embedded memory, up to 560 I/Os, a core supply range of 950 mV to 1.05 V, and a commercial operating temperature range of 0 °C to 85 °C—all in a surface-mount 1153-BBGA / 1153-FCBGA (35x35) package. The device is RoHS compliant.

Key Features

• Logic Capacity – 82,944 logic elements provide substantial programmable fabric for implementing complex digital functions and parallel processing blocks.
• Embedded Memory – Approximately 3.54 Mbits of on-chip RAM to support buffering, FIFO, and local data storage requirements without external memory.
• I/O Density – Up to 560 user I/Os to support multiple external interfaces, parallel buses, and mixed-signal front-ends.
• Power and Supply – Core voltage supply range of 950 mV to 1.05 V to match system power rails and enable deterministic core operation.
• Package and Mounting – 1153-BBGA / 1153-FCBGA (supplier package: 1153-FCBGA (35x35)) in a surface-mount form factor for compact board-level integration.
• Temperature and Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C for standard consumer and industrial-adjacent applications.
• Regulatory – RoHS compliant.

Typical Applications

• High-density digital logic implementations – Use the device’s large logic element count to implement complex state machines, datapaths, and custom accelerators.
• I/O-intensive systems – Leverage up to 560 I/Os to connect multiple peripherals, external memory interfaces, or parallel sensor arrays.
• Embedded system prototyping – The combination of logic capacity and on-chip memory supports prototyping and proof-of-concept development for complex digital designs.
• Custom interface and protocol handling – Implement bespoke interface logic or multiple protocol controllers within a single FPGA device.

Unique Advantages

• High logic density: 82,944 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 3.54 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Extensive I/O capability: 560 I/Os provide flexibility for connecting numerous peripherals, buses, and external devices without I/O multiplexing.
• Compact, surface-mount package: 1153-FCBGA (35x35) package supports dense PCB layouts while maintaining a robust mounting method.
• Clear supply and thermal envelope: Specified core voltage range (950 mV–1.05 V) and commercial temperature rating simplify power budgeting and thermal planning for standard applications.
• RoHS compliant: Meets common regulatory requirements for lead-free manufacturing flows.

Why Choose XC5VLX85-3FFG1153C?

The XC5VLX85-3FFG1153C is positioned for designs that require a combination of high logic capacity, meaningful on-chip memory, and substantial I/O connectivity in a single surface-mount package. Its specifications make it suitable for projects that prioritize integration and board-space efficiency while operating within commercial temperature limits.

Engineers and procurement teams looking for a RoHS-compliant Virtex®-5 LX FPGA from AMD can leverage this device to consolidate functions, reduce BOM complexity, and support scalable digital designs that need dense logic and memory resources.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC5VLX85-3FFG1153C.