XC5VLX85-2FFG1153I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 560 3538944 82944 1153-BBGA, FCBGA |
|---|---|
| Quantity | 132 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 560 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6480 | Number of Logic Elements/Cells | 82944 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC5VLX85-2FFG1153I – Virtex®-5 LX Field Programmable Gate Array, 1153-FCBGA
The XC5VLX85-2FFG1153I is a Virtex-5 LX family Field Programmable Gate Array (FPGA) manufactured by AMD. It is specified as an industrial-grade device with high logic capacity, substantial on-chip RAM, and a large number of user I/Os.
Key platform-level specifications include 82,944 logic elements, approximately 3.5 Mbits of embedded memory (3,538,944 bits), 560 I/Os, an operating voltage window of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 100 °C. The device is supplied in a 1153-FCBGA (35×35) surface-mount package and is RoHS compliant.
Key Features
- Core / Logic Capacity 6,480 configurable logic blocks (CLBs) delivering a total of 82,944 logic elements for implementing complex digital logic.
- Embedded Memory Approximately 3.5 Mbits of on-chip RAM (3,538,944 bits) for on-die storage and data buffering.
- I/O Resources 560 user I/Os to support dense external connectivity and multiple interface endpoints.
- Power Supply Specified core supply range from 0.95 V to 1.05 V for core regulation and power planning.
- Package & Mounting 1153-BBGA / 1153-FCBGA (35×35 mm) supplier device package, designed for surface-mount assembly.
- Temperature & Grade Industrial-grade operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant.
Unique Advantages
- High logic density: 82,944 logic elements enable implementation of large, complex designs on a single device.
- Substantial on-chip memory: Approximately 3.5 Mbits of embedded RAM reduces reliance on external memory components.
- Extensive I/O count: 560 user I/Os accommodate multiple peripherals and high-pin-count interfaces without external expanders.
- Industrial temperature rating: −40 °C to 100 °C supports reliable operation across a wide range of industrial environments.
- Surface-mount FCBGA package: 1153-FCBGA (35×35) package supports compact board layouts and standard SMT assembly processes.
- Regulatory compliance: RoHS compliance simplifies environmental qualification for product builds.
Why Choose XC5VLX85-2FFG1153I?
The XC5VLX85-2FFG1153I provides a combination of high logic capacity, significant on-chip RAM, and a large I/O complement within an industrial-grade FPGA package. These characteristics make it well suited for designs that require dense programmable logic, plentiful embedded memory, and broad external interfacing capabilities while meeting industrial temperature requirements.
Manufactured by AMD and supplied in a 1153-FCBGA surface-mount package, this device offers a clear specification set for engineers and procurement teams planning scalable, reliable FPGA-based solutions.
Request a quote or submit an inquiry to obtain pricing and availability information for the XC5VLX85-2FFG1153I.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
