XC5VLX85-2FF1153C

The XC5VLX85-2FF1153C is a Virtex®-5 LX field programmable gate array (FPGA) IC from AMD, offered in a 1153-ball FCBGA package. It provides a high logic element count and substantial on-chip RAM to support complex digital designs that require significant parallel logic and memory resources.

Key device characteristics include 82,944 logic elements, approximately 3.5 Mbits of embedded memory, and 560 general-purpose I/O pins, enabling dense, I/O‑heavy designs in a surface-mount FCBGA footprint for commercial applications.

Key Features

• Core Logic — 82,944 logic elements to implement large-scale custom logic and parallel processing functions.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM for buffering, look-up tables, and local data storage close to logic.
• I/O Capacity — 560 I/O pins suitable for designs that require extensive external interfacing and multi-channel connectivity.
• Package — 1153-ball BGA (1153-FCBGA, 35×35 mm) surface-mount package for board-level integration where area-efficient, high-pin-count routing is needed.
• Power — Core voltage supply range from 950 mV to 1.05 V, enabling defined power delivery and planning for core rails.
• Operating Conditions — Commercial grade device specified for 0 °C to 85 °C operation.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital systems — Implements large custom logic blocks and parallel datapaths using 82,944 logic elements.
• Memory-intensive designs — Uses approximately 3.5 Mbits of embedded RAM for buffering, FIFOs, and local storage in data processing pipelines.
• Multi-interface boards — Leverages 560 I/O pins to connect to multiple peripherals, sensors, or high-channel-count front-ends.

Unique Advantages

• High logic capacity: 82,944 logic elements provide room for complex finite-state machines, parallel compute blocks, and custom accelerators.
• Substantial on-chip memory: Approximately 3.5 Mbits of RAM reduces external memory dependence and shortens data paths for improved latency.
• Large I/O count: 560 I/O pins simplify system-level connectivity and reduce the need for external multiplexing.
• Compact, manufacturable package: 1153-FCBGA (35×35) surface-mount package supports high-density PCB layouts and modern assembly processes.
• Defined power envelope: Core voltage range of 950 mV to 1.05 V allows precise power-supply design and verification.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.

Why Choose XC5VLX85-2FF1153C?

The XC5VLX85-2FF1153C positions itself as a high-capacity Virtex-5 LX FPGA option for designers who need large logic resources, significant on-chip memory, and a high I/O count in a compact FCBGA package. Its combination of 82,944 logic elements, approximately 3.5 Mbits of embedded RAM, and 560 I/Os makes it well suited to complex digital designs requiring dense integration on commercial-grade hardware.

This device is appropriate for teams building scalable, logic‑intensive systems where board-level integration, predictable power rails, and RoHS-compliant manufacturing are priorities. It offers a clear hardware platform for developing and deploying sizable custom logic and memory-centric architectures.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XC5VLX85-2FF1153C. Technical and purchasing teams can provide specific lead-time and ordering details on request.