XC5VSX95T-2FFG1136C

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 640 8994816 94208 1136-BBGA, FCBGA

Quantity 50 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs7360Number of Logic Elements/Cells94208
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits8994816

Overview of XC5VSX95T-2FFG1136C – Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC

The XC5VSX95T-2FFG1136C is a Virtex®-5 SXT field programmable gate array (FPGA) offered in a 1136-FCBGA (35×35) package. It delivers a high-density fabric with 94,208 logic elements and approximately 9.0 Mbits of embedded memory, making it suitable for designs that require substantial on-chip logic and memory resources.

Featuring 640 user I/Os, a low-voltage core supply range of 0.95 V to 1.05 V, a commercial operating temperature range of 0 °C to 85 °C, and RoHS compliance, this device is positioned for commercial embedded and system-level applications that demand high integration in a compact surface-mount package.

Key Features

  • Core Logic  High-density FPGA fabric with 94,208 logic elements to implement complex digital logic and custom hardware acceleration.
  • Embedded Memory  Approximately 9.0 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage without external memory for many functions.
  • I/O Capacity  640 user I/O pins to support wide peripheral interfacing, parallel buses, and multi-channel connectivity.
  • Power  Core supply voltage range of 0.95 V to 1.05 V for compatibility with low-voltage system power rails.
  • Package & Mounting  1136-FCBGA (35×35) package case, 1136-BBGA, FCBGA footprint, designed for surface-mount assembly.
  • Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

  • High-density logic implementations  Deploy where large numbers of logic elements and embedded RAM are required to implement complex state machines, packet processing, or custom accelerators.
  • I/O-intensive systems  Use in designs that need many external interfaces or high pin counts, leveraging the 640 user I/Os for parallel and multi-channel connections.
  • Embedded processing and buffering  Take advantage of approximately 9.0 Mbits of on-chip RAM for intermediate buffering, FIFOs, and small data stores to reduce external memory dependence.

Unique Advantages

  • High integration density: Combines 94,208 logic elements with substantial embedded memory to reduce the need for external discrete logic and memory components.
  • Large I/O resource: 640 user I/Os simplify integration with multiple peripherals, sensors, and bus interfaces, reducing board-level multiplexing.
  • Compact FCBGA package: 1136-FCBGA (35×35) form factor enables high-density implementations in surface-mount assemblies.
  • Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial electronics production.
  • Low-voltage core operation: 0.95 V to 1.05 V supply requirement aligns with low-voltage power architectures to help manage overall system power.

Why Choose XC5VSX95T-2FFG1136C?

The XC5VSX95T-2FFG1136C delivers a balanced combination of high logic density, substantial on-chip memory, and an extensive I/O count in a compact 1136-FCBGA surface-mount package. Its commercial-grade operating range and RoHS compliance make it a practical choice for embedded systems and complex digital designs that require integrated logic and memory resources without an oversized board footprint.

This device is well suited for engineers and system designers focused on high-density FPGA implementations, I/O-rich interfaces, and designs that benefit from significant on-chip RAM. With AMD's Virtex®-5 SXT architecture as the platform, the part offers a clear path for projects needing robust FPGA resources within commercial temperature and voltage specifications.

Request a quote or submit a request for pricing and availability to obtain more information or to begin procuring the XC5VSX95T-2FFG1136C for your next project.

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