XC5VSX95T-1FFG1136C
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 640 8994816 94208 1136-BBGA, FCBGA |
|---|---|
| Quantity | 656 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 7360 | Number of Logic Elements/Cells | 94208 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8994816 |
Overview of XC5VSX95T-1FFG1136C – Virtex®-5 SXT FPGA, 640 I/O, 1136‑FCBGA
The XC5VSX95T-1FFG1136C is a Virtex®-5 SXT field programmable gate array from AMD, specified for commercial applications. It combines a high count of logic resources and on-chip RAM with a large I/O complement and a compact 1136‑FCBGA package to support dense, programmable digital designs.
Designed for systems that require substantial embedded memory, extensive I/O, and significant programmable logic capacity, this device delivers a balance of integration and configuration flexibility while operating within a standard commercial temperature range.
Key Features
- Programmable Logic Capacity — Approximately 94,208 logic elements provide substantial room for implementing complex custom logic and parallel datapaths.
- Embedded Memory — Approximately 8.99 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage for high-throughput designs.
- I/O Density — 640 I/O pins enable extensive external interfacing for multi-channel systems, high-pin-count connectors, and dense board-level integration.
- Power Supply — Core voltage specified at 0.95 V to 1.05 V, enabling predictable power planning for system design.
- Package and Mounting — 1136‑FCBGA (35×35) supplier package in a surface-mount BGA footprint (1136‑BBGA), supporting compact board layouts.
- Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for environmental compliance considerations.
Typical Applications
- Custom digital acceleration — Use on-chip logic and approximately 8.99 Mbits of embedded memory to implement hardware-accelerated datapaths and algorithm offload.
- High-density I/O bridging — 640 I/O pins enable interface aggregation, protocol bridging, and complex peripheral connectivity on a single device.
- Embedded system prototyping — Substantial logic capacity (≈94,208 logic elements) supports development and verification of system-level functions and IP integration.
Unique Advantages
- High logic and memory integration: Combines approximately 94k logic elements with about 8.99 Mbits of embedded RAM to reduce external memory and discrete logic requirements.
- Extensive external connectivity: 640 I/O pins simplify designs that require multiple interfaces or parallel data channels, reducing the need for additional interface chips.
- Compact board footprint: 1136‑FCBGA (35×35) surface-mount package enables high-density PCB layouts while keeping the programmable logic centralized.
- Predictable power envelope: Core voltage range of 0.95 V to 1.05 V allows precise power-supply design and thermal planning.
- Commercial availability and compliance: AMD manufacturing and RoHS compliance align with standard commercial production and environmental requirements.
Why Choose XC5VSX95T-1FFG1136C?
The XC5VSX95T-1FFG1136C positions itself as a capable commercial-grade Virtex®-5 SXT FPGA that delivers a strong combination of logic capacity, embedded memory, and I/O density in a single, compact package. Its specification set makes it well suited for designers who need substantial on-chip resources and flexible interfacing in commercial applications.
Backed by AMD manufacturing and RoHS compliance, this device offers a durable platform for scalable designs where integration density and predictable electrical and thermal characteristics are important.
Request a quote or contact sales to discuss availability, lead times, and pricing for the XC5VSX95T-1FFG1136C. Provide your application details and quantity requirements to receive a tailored response.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








