XC5VSX50T-2FFG665I
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,054 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-2FFG665I – Virtex®-5 SXT FPGA, 665-FCBGA
The XC5VSX50T-2FFG665I is a Virtex-5 SXT field programmable gate array (FPGA) IC from AMD. It delivers a high integration of programmable logic, on-chip memory and I/O — including 4,080 configurable logic blocks (CLBs), 52,224 logic elements, approximately 4.87 Mbits of embedded memory and 360 I/O — in a 665-FCBGA (27×27) surface-mount package, with operation from 0.95 V to 1.05 V and an industrial temperature range of −40 °C to 100 °C.
Key Features
- Programmable Logic Capacity 4,080 configurable logic blocks (CLBs) and 52,224 logic elements provide extensive resources for implementing complex digital designs.
- Embedded Memory Approximately 4.87 Mbits of on-chip RAM for buffering, state storage and data processing without external memory in many use cases.
- I/O Count 360 user I/O pins to support a wide range of interfaces and peripheral connections.
- Power Supply Range Core voltage operation from 0.95 V to 1.05 V to match platform power-rail requirements.
- Package and Mounting 665-BBGA / 665-FCBGA package in a 27×27 mm footprint, supplied for surface-mount assembly.
- Industrial Temperature Grade Specified for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High logic density: 52,224 logic elements enable substantial functional integration on a single device, reducing external components.
- Significant embedded memory: Approximately 4.87 Mbits of on-chip RAM support data buffering and local storage to simplify system memory architecture.
- Extensive I/O capability: 360 I/O signals allow flexible interfacing to sensors, peripherals and high-pin-count systems.
- Industrial robustness: Rated for −40 °C to 100 °C operation for designs requiring extended temperature range performance.
- Compact BGA implementation: 665-FCBGA (27×27) surface-mount package offers a dense, manufacturable form factor for space-constrained boards.
- Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and procurement.
Why Choose XC5VSX50T-2FFG665I?
The XC5VSX50T-2FFG665I positions itself as a highly integrated Virtex-5 SXT FPGA offering a balance of logic capacity, embedded memory and I/O density in a compact 665-FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployment in designs that require robust environmental characteristics and regulatory alignment.
This FPGA is well suited for designs that need substantial on-chip logic and memory resources combined with a high number of I/O signals, providing designers with a single-device option to reduce BOM complexity and support scalable, long-lived projects backed by AMD device lineage.
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