XC5VSX50T-2FFG665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA

Quantity 1,054 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-2FFG665I – Virtex®-5 SXT FPGA, 665-FCBGA

The XC5VSX50T-2FFG665I is a Virtex-5 SXT field programmable gate array (FPGA) IC from AMD. It delivers a high integration of programmable logic, on-chip memory and I/O — including 4,080 configurable logic blocks (CLBs), 52,224 logic elements, approximately 4.87 Mbits of embedded memory and 360 I/O — in a 665-FCBGA (27×27) surface-mount package, with operation from 0.95 V to 1.05 V and an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Programmable Logic Capacity  4,080 configurable logic blocks (CLBs) and 52,224 logic elements provide extensive resources for implementing complex digital designs.
  • Embedded Memory  Approximately 4.87 Mbits of on-chip RAM for buffering, state storage and data processing without external memory in many use cases.
  • I/O Count  360 user I/O pins to support a wide range of interfaces and peripheral connections.
  • Power Supply Range  Core voltage operation from 0.95 V to 1.05 V to match platform power-rail requirements.
  • Package and Mounting  665-BBGA / 665-FCBGA package in a 27×27 mm footprint, supplied for surface-mount assembly.
  • Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
  • Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 52,224 logic elements enable substantial functional integration on a single device, reducing external components.
  • Significant embedded memory: Approximately 4.87 Mbits of on-chip RAM support data buffering and local storage to simplify system memory architecture.
  • Extensive I/O capability: 360 I/O signals allow flexible interfacing to sensors, peripherals and high-pin-count systems.
  • Industrial robustness: Rated for −40 °C to 100 °C operation for designs requiring extended temperature range performance.
  • Compact BGA implementation: 665-FCBGA (27×27) surface-mount package offers a dense, manufacturable form factor for space-constrained boards.
  • Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and procurement.

Why Choose XC5VSX50T-2FFG665I?

The XC5VSX50T-2FFG665I positions itself as a highly integrated Virtex-5 SXT FPGA offering a balance of logic capacity, embedded memory and I/O density in a compact 665-FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployment in designs that require robust environmental characteristics and regulatory alignment.

This FPGA is well suited for designs that need substantial on-chip logic and memory resources combined with a high number of I/O signals, providing designers with a single-device option to reduce BOM complexity and support scalable, long-lived projects backed by AMD device lineage.

Request a quote or submit an inquiry to receive pricing, availability and delivery information for the XC5VSX50T-2FFG665I.

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