XC5VSX50T-2FF665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA

Quantity 620 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-2FF665I – Virtex®-5 SXT FPGA, 665-FCBGA (Industrial)

The XC5VSX50T-2FF665I is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC from AMD designed for high-density, configurable digital logic implementations. It combines a large logic resource pool with substantial on-chip memory and extensive I/O in a 665-ball FCBGA package to support industrial-grade embedded designs.

Key value propositions include a high logic element count, approximately 4.9 Mbits of embedded RAM, and a wide operating temperature range, making the device suitable for designs that require significant programmable logic, on-chip storage, and robust thermal performance.

Key Features

  • Logic Resources 52,224 logic elements provide substantial programmable logic capacity for complex custom functions and parallel processing pipelines.
  • Embedded Memory Approximately 4.9 Mbits of total on-chip RAM for buffering, FIFOs, and data storage without immediate reliance on external memory.
  • I/O Density 360 general-purpose I/O pins to accommodate multiple interfaces, parallel buses, and extensive peripheral connectivity.
  • Package and Mounting 665-FCBGA package (27 × 27 mm) in a surface-mount form factor for high-density board integration and reliable soldered connections.
  • Power Core supply range from 950 mV to 1.05 V, allowing designers to plan power delivery and voltage sequencing around the device’s specified core requirements.
  • Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet a wide set of environmental conditions.
  • Regulatory Compliance RoHS compliant for adherence to common environmental directives.

Typical Applications

  • Custom FPGA-Based Systems Implement complex, application-specific logic using the device’s 52,224 logic elements and embedded RAM for on-chip data handling.
  • High-Density I/O Controllers Leverage 360 I/Os to interface with multiple sensors, peripherals, or parallel data buses in a single FPGA solution.
  • Industrial Automation and Control Industrial-grade temperature range and robust packaging suit deployed control systems that require reliable programmable logic in varied environments.
  • Embedded Memory-Intensive Designs Use the approximately 4.9 Mbits of on-chip RAM for buffering, temporary storage, and latency-sensitive data paths to reduce external memory dependence.

Unique Advantages

  • High Logic Capacity: 52,224 logic elements enable dense implementation of custom algorithms and parallel processing architectures, reducing the need for multiple devices.
  • Substantial On-Chip RAM: Approximately 4.9 Mbits of embedded memory supports large buffers and internal data structures, simplifying board-level memory design.
  • Extensive I/O Count: 360 I/Os allow consolidation of multiple interfaces and peripherals onto a single FPGA, lowering BOM complexity.
  • Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to meet the thermal requirements of industrial deployments.
  • Compact, High-Density Package: 665-FCBGA (27 × 27 mm) packaging delivers high pin count in a compact footprint for space-constrained PCB layouts.
  • RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs and supply-chain compliance.

Why Choose XC5VSX50T-2FF665I?

The XC5VSX50T-2FF665I positions itself as a high-capacity, industrial-grade FPGA that balances large programmable logic resources, meaningful on-chip memory, and substantial I/O in a compact 665-ball FCBGA package. These attributes make it well suited for engineers and teams building complex, configurable systems that require on-device memory, high I/O density, and operation across a broad temperature range.

For development and production designs that prioritize integration, thermal robustness, and adherence to environmental regulations, this Virtex-5 SXT device provides a verifiable platform whose specifications support scalable, long-term deployment and easier system-level planning.

Request a quote or submit your requirements today to receive pricing and availability information for the XC5VSX50T-2FF665I.

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