XC5VSX50T-2FF665I
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA |
|---|---|
| Quantity | 620 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-2FF665I – Virtex®-5 SXT FPGA, 665-FCBGA (Industrial)
The XC5VSX50T-2FF665I is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC from AMD designed for high-density, configurable digital logic implementations. It combines a large logic resource pool with substantial on-chip memory and extensive I/O in a 665-ball FCBGA package to support industrial-grade embedded designs.
Key value propositions include a high logic element count, approximately 4.9 Mbits of embedded RAM, and a wide operating temperature range, making the device suitable for designs that require significant programmable logic, on-chip storage, and robust thermal performance.
Key Features
- Logic Resources 52,224 logic elements provide substantial programmable logic capacity for complex custom functions and parallel processing pipelines.
- Embedded Memory Approximately 4.9 Mbits of total on-chip RAM for buffering, FIFOs, and data storage without immediate reliance on external memory.
- I/O Density 360 general-purpose I/O pins to accommodate multiple interfaces, parallel buses, and extensive peripheral connectivity.
- Package and Mounting 665-FCBGA package (27 × 27 mm) in a surface-mount form factor for high-density board integration and reliable soldered connections.
- Power Core supply range from 950 mV to 1.05 V, allowing designers to plan power delivery and voltage sequencing around the device’s specified core requirements.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet a wide set of environmental conditions.
- Regulatory Compliance RoHS compliant for adherence to common environmental directives.
Typical Applications
- Custom FPGA-Based Systems Implement complex, application-specific logic using the device’s 52,224 logic elements and embedded RAM for on-chip data handling.
- High-Density I/O Controllers Leverage 360 I/Os to interface with multiple sensors, peripherals, or parallel data buses in a single FPGA solution.
- Industrial Automation and Control Industrial-grade temperature range and robust packaging suit deployed control systems that require reliable programmable logic in varied environments.
- Embedded Memory-Intensive Designs Use the approximately 4.9 Mbits of on-chip RAM for buffering, temporary storage, and latency-sensitive data paths to reduce external memory dependence.
Unique Advantages
- High Logic Capacity: 52,224 logic elements enable dense implementation of custom algorithms and parallel processing architectures, reducing the need for multiple devices.
- Substantial On-Chip RAM: Approximately 4.9 Mbits of embedded memory supports large buffers and internal data structures, simplifying board-level memory design.
- Extensive I/O Count: 360 I/Os allow consolidation of multiple interfaces and peripherals onto a single FPGA, lowering BOM complexity.
- Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to meet the thermal requirements of industrial deployments.
- Compact, High-Density Package: 665-FCBGA (27 × 27 mm) packaging delivers high pin count in a compact footprint for space-constrained PCB layouts.
- RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs and supply-chain compliance.
Why Choose XC5VSX50T-2FF665I?
The XC5VSX50T-2FF665I positions itself as a high-capacity, industrial-grade FPGA that balances large programmable logic resources, meaningful on-chip memory, and substantial I/O in a compact 665-ball FCBGA package. These attributes make it well suited for engineers and teams building complex, configurable systems that require on-device memory, high I/O density, and operation across a broad temperature range.
For development and production designs that prioritize integration, thermal robustness, and adherence to environmental regulations, this Virtex-5 SXT device provides a verifiable platform whose specifications support scalable, long-term deployment and easier system-level planning.
Request a quote or submit your requirements today to receive pricing and availability information for the XC5VSX50T-2FF665I.

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