XC5VSX50T-2FF1136I
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 480 4866048 52224 1136-BBGA, FCBGA |
|---|---|
| Quantity | 559 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 480 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-2FF1136I – Virtex®-5 SXT FPGA, 1136-FCBGA
The XC5VSX50T-2FF1136I is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) from AMD, supplied in a 1136-FCBGA surface-mount package. It combines high-density programmable logic, substantial embedded memory, and a large I/O count to support complex, high-channel-count digital designs.
Designed for industrial-grade deployments, this device delivers a balance of logic capacity, on-chip memory, and interfacing capability while operating from a low-voltage core supply.
Key Features
- Core Logic 52,224 logic elements provide the programmable resources needed for complex custom logic, state machines, and datapath implementations.
- On-chip Memory Approximately 4.87 Mbits of embedded memory supports buffering, frame storage, and local data structures without immediate external RAM.
- I/O Capacity 480 user I/O pins accommodate high-channel-count interfaces, parallel buses, and dense peripheral connectivity.
- Power Core voltage range from 0.95 V to 1.05 V for compatibility with modern low-voltage supply domains.
- Package & Mounting 1136-FCBGA supplier device package (35×35) in a surface-mount form factor for compact, high-density PCB implementations.
- Operating Range & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
- Compliance RoHS-compliant manufacturing to meet material and environmental requirements.
Typical Applications
- Industrial Control Implement custom control logic, sensor aggregation, and real-time processing using the device’s sizable logic and memory resources within industrial temperature ranges.
- Communications & Networking Support protocol processing, parallel interface handling, and high-density I/O for board-level networking and communications equipment.
- Signal and Data Processing Use embedded memory and abundant logic elements for buffering, preprocessing, and custom datapath acceleration in digital signal workflows.
- Prototyping & Custom Hardware Ideal for developing and validating complex FPGA-based designs that require a large logic fabric and plentiful I/O.
Unique Advantages
- High logic capacity: 52,224 logic elements enable implementation of large custom designs without immediate partitioning.
- Substantial embedded memory: Approximately 4.87 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state storage tasks.
- Extensive I/O: 480 I/O pins support multiple parallel interfaces and high channel counts on a single device.
- Industrial robustness: −40 °C to 100 °C operating range suits deployments in temperature-variable industrial environments.
- Compact, surface-mount FCBGA package: 1136-FCBGA (35×35) provides a high-density footprint for space-constrained PCBs.
- Low-voltage core compatibility: 0.95 V–1.05 V supply range aligns with contemporary low-voltage system designs.
Why Choose XC5VSX50T-2FF1136I?
The XC5VSX50T-2FF1136I positions itself as a high-capacity, industrial-grade FPGA option that combines a large programmable fabric, meaningful embedded memory, and extensive I/O in a compact FCBGA package. It is well suited for engineers and designers building complex digital systems that need on-chip resources for processing, buffering, and interfacing while operating across a wide temperature range.
Backed by AMD manufacturing and RoHS compliance, this part offers a clear hardware platform for scalable designs where integration density and industrial operating conditions are primary considerations.
Request a quote or submit a procurement inquiry to receive pricing and availability for the XC5VSX50T-2FF1136I for your next project.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








