XC5VSX50T-2FFG1136C
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 480 4866048 52224 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,519 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 480 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-2FFG1136C – Virtex®-5 SXT FPGA, 1136-FCBGA
The XC5VSX50T-2FFG1136C is a Virtex-5 SXT field programmable gate array (FPGA) from AMD offered in a 1136-FCBGA package. It delivers a combination of high logic capacity, substantial embedded memory, and a large I/O count for designs that require dense, programmable logic integration.
With 52,224 logic elements, approximately 4.87 Mbits of embedded memory and 480 I/O, this device is suited for applications that demand extensive programmable resources, high I/O connectivity and board-level integration in a surface-mount FCBGA form factor.
Key Features
- Core Logic 52,224 logic elements providing large programmable fabric for implementing complex digital functions and custom logic.
- Embedded Memory Approximately 4.87 Mbits of on-chip RAM for data buffering, FIFOs and local storage within the FPGA fabric.
- I/O Capacity 480 I/O pins to support high channel counts, parallel interfaces and multi‑lane connectivity on board-level designs.
- Package 1136‑BBGA / 1136‑FCBGA (35 × 35 mm) package case suitable for high-density board integration and surface-mount assembly.
- Power Specified core voltage range of 0.95 V to 1.05 V for the FPGA core supply.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Mounting & Compliance Surface-mount device; RoHS compliant for environmental and regulatory compatibility.
Typical Applications
- Custom Logic Implementation Use the device for implementing complex, application-specific digital logic where large programmable fabric is required.
- Memory-Intensive Designs Embedded memory resources support buffering, packet storage or local data handling inside the FPGA.
- High‑Density I/O Systems Large I/O count enables interfacing to multiple parallel buses, sensors, or multi-channel front ends on a single board.
- Board-Level Integration 1136-FCBGA package allows compact, high-density integration in systems that require surface-mount FPGA solutions.
Unique Advantages
- High Logic Capacity: 52,224 logic elements enable implementation of large-scale custom logic without immediate partitioning across multiple devices.
- Substantial On-Chip Memory: Approximately 4.87 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks, simplifying system design.
- Extensive I/O Count: 480 I/O pins provide flexibility to connect multiple peripherals, buses and high-channel-count subsystems directly to the FPGA.
- Compact Package: 1136-FCBGA (35 × 35 mm) offers a high-pin-count, surface-mount solution for space-constrained boards requiring dense connectivity.
- Controlled Core Supply Range: Defined 0.95 V–1.05 V core voltage window supports predictable power planning and supply design.
- Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and end-product compliance requirements.
Why Choose XC5VSX50T-2FFG1136C?
The XC5VSX50T-2FFG1136C positions itself as a high-capacity Virtex-5 SXT FPGA option for designers who need a balance of logic density, embedded memory and high I/O count in a surface-mount FCBGA package. Its on-chip resources and extensive I/O make it suitable for consolidating complex functions onto a single programmable device, simplifying board-level architectures.
As a commercial-grade, RoHS-compliant device with clearly specified supply and temperature ranges, it is appropriate for development and production systems that require predictable electrical and thermal characteristics. The combination of logic, memory and packaging supports scalable designs and long-term deployment where programmable flexibility and integration density are priorities.
Request a quote or submit a purchase inquiry today to get pricing and availability for the XC5VSX50T-2FFG1136C. Our team will provide the information you need to evaluate this FPGA for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








