XC5VSX50T-3FFG665C

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA

Quantity 1,684 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-3FFG665C – Virtex®-5 SXT FPGA, 665-FCBGA (27×27)

The XC5VSX50T-3FFG665C is a Virtex®-5 SXT field programmable gate array (FPGA) from AMD supplied in a 665-ball FCBGA package. It provides a mid-range FPGA fabric with 52,224 logic elements, substantial on-chip memory and a high I/O count for compact, board-level integration.

This commercial-grade, surface-mount FPGA is specified for a core voltage range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

  • Logic Capacity  52,224 logic elements to implement medium-complexity digital designs and custom RTL functions.
  • Embedded Memory  Approximately 4.9 Mbits of on-chip RAM for buffering, state storage and fast local data access.
  • I/O Density  360 user I/O pins to support multiple parallel interfaces and densely routed board layouts.
  • Power  Core supply specified from 0.95 V to 1.05 V to match system power rails and support predictable power planning.
  • Package & Mounting  665-FCBGA (27×27 mm) surface-mount package for high-density board integration and thermal coupling.
  • Temperature & Grade  Commercial grade operation over 0 °C to 85 °C for near-room-temperature embedded and commercial products.
  • Regulatory  RoHS compliant material and assembly status.

Unique Advantages

  • Substantial logic resources: 52,224 logic elements enable implementation of sizable custom logic blocks without immediate need for larger devices.
  • Significant on-chip memory: Approximately 4.9 Mbits of embedded RAM reduces external memory dependency for buffering and data path functions.
  • High I/O count in compact package: 360 I/Os in a 665-ball FCBGA (27×27) package offers a balance of connectivity and board-area efficiency.
  • Predictable power envelope: Narrow core voltage range (0.95–1.05 V) simplifies power-supply design and sequencing considerations.
  • Commercial temperature and RoHS compliance: Suited to commercial embedded applications where these environmental and regulatory conditions are required.

Why Choose XC5VSX50T-3FFG665C?

The XC5VSX50T-3FFG665C positions itself as a mid-range Virtex®-5 SXT FPGA option that combines a substantial logic element count, several megabits of embedded memory and a high I/O complement in a compact 665-FCBGA package. Its specified core voltage range and commercial operating temperature make it appropriate for commercial embedded designs that require solid on-chip resources without moving to larger device classes.

For designers seeking a commercially graded FPGA with documented device characteristics from AMD and a balance of logic, memory and I/O density, the XC5VSX50T-3FFG665C offers a clearly specified platform for integration into mid-complexity digital systems.

Request a quote or submit your procurement inquiry to evaluate XC5VSX50T-3FFG665C availability and pricing for your next design.

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