XC5VSX50T-3FFG665C
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,684 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-3FFG665C – Virtex®-5 SXT FPGA, 665-FCBGA (27×27)
The XC5VSX50T-3FFG665C is a Virtex®-5 SXT field programmable gate array (FPGA) from AMD supplied in a 665-ball FCBGA package. It provides a mid-range FPGA fabric with 52,224 logic elements, substantial on-chip memory and a high I/O count for compact, board-level integration.
This commercial-grade, surface-mount FPGA is specified for a core voltage range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C, and is RoHS compliant.
Key Features
- Logic Capacity 52,224 logic elements to implement medium-complexity digital designs and custom RTL functions.
- Embedded Memory Approximately 4.9 Mbits of on-chip RAM for buffering, state storage and fast local data access.
- I/O Density 360 user I/O pins to support multiple parallel interfaces and densely routed board layouts.
- Power Core supply specified from 0.95 V to 1.05 V to match system power rails and support predictable power planning.
- Package & Mounting 665-FCBGA (27×27 mm) surface-mount package for high-density board integration and thermal coupling.
- Temperature & Grade Commercial grade operation over 0 °C to 85 °C for near-room-temperature embedded and commercial products.
- Regulatory RoHS compliant material and assembly status.
Unique Advantages
- Substantial logic resources: 52,224 logic elements enable implementation of sizable custom logic blocks without immediate need for larger devices.
- Significant on-chip memory: Approximately 4.9 Mbits of embedded RAM reduces external memory dependency for buffering and data path functions.
- High I/O count in compact package: 360 I/Os in a 665-ball FCBGA (27×27) package offers a balance of connectivity and board-area efficiency.
- Predictable power envelope: Narrow core voltage range (0.95–1.05 V) simplifies power-supply design and sequencing considerations.
- Commercial temperature and RoHS compliance: Suited to commercial embedded applications where these environmental and regulatory conditions are required.
Why Choose XC5VSX50T-3FFG665C?
The XC5VSX50T-3FFG665C positions itself as a mid-range Virtex®-5 SXT FPGA option that combines a substantial logic element count, several megabits of embedded memory and a high I/O complement in a compact 665-FCBGA package. Its specified core voltage range and commercial operating temperature make it appropriate for commercial embedded designs that require solid on-chip resources without moving to larger device classes.
For designers seeking a commercially graded FPGA with documented device characteristics from AMD and a balance of logic, memory and I/O density, the XC5VSX50T-3FFG665C offers a clearly specified platform for integration into mid-complexity digital systems.
Request a quote or submit your procurement inquiry to evaluate XC5VSX50T-3FFG665C availability and pricing for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








