XC5VSX50T-1FFG665C

The XC5VSX50T-1FFG665C is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) from AMD provided in a 665-ball FCBGA surface-mount package. It integrates a large logic fabric, substantial on‑chip RAM, and a high I/O count suitable for designs that require significant programmable logic capacity within a compact package.

Key device attributes include 52,224 logic elements across 4,080 CLBs, approximately 4.87 Mbits of embedded memory, and 360 I/O pins. The device operates from a 0.95 V to 1.05 V core supply and is specified for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant.

Key Features

• Core Logic  52,224 logic elements implemented across 4,080 CLBs, providing substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 4.87 Mbits of on‑chip RAM for buffering, state storage, and intermediate data processing without external memory.
• I/O Resources  360 user I/O pins to support high‑pin‑count interfacing and mixed-signal board topologies using a single device.
• Package and Mounting  665-ball FCBGA package (665-BBGA, 27×27) in a surface-mount form factor for compact board-level integration.
• Power  Core supply voltage range of 0.95 V to 1.05 V to match system power rails and design margins.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronic applications.
• Compliance  RoHS compliant for lead‑free manufacturing and regulatory conformance.

Typical Applications

• Custom digital logic implementations  Use the device's 52,224 logic elements and 4,080 CLBs to implement complex user-defined digital functions and accelerators.
• On‑chip buffering and data handling  Approximately 4.87 Mbits of embedded memory supports local buffering, FIFOs, and temporary data storage without immediate external memory.
• High‑pin‑count I/O interfacing  360 I/O pins enable integration with multiple external peripherals, sensors, and parallel interfaces on a single board.
• Compact, board‑level FPGA integration  The 665-FCBGA (27×27) surface-mount package delivers high integration in a compact footprint for space-constrained designs.

Unique Advantages

• High logic capacity: 52,224 logic elements across 4,080 CLBs provide the headroom needed for substantial programmable logic in a single device, reducing the need for multi‑FPGA solutions.
• Significant embedded memory: Approximately 4.87 Mbits of on‑chip RAM allows designers to implement buffers and local storage without relying solely on external memory devices.
• Extensive I/O count: 360 I/O pins support complex board-level connectivity, enabling integration with many peripherals and interfaces.
• Compact FCBGA packaging: The 665-ball FCBGA (27×27) package offers a dense, surface-mount solution for high-performance boards where space is at a premium.
• Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial production and regulatory requirements.
• Controlled core supply range: Core voltage specified from 0.95 V to 1.05 V to align with system power design requirements.

Why Choose XC5VSX50T-1FFG665C?

The XC5VSX50T-1FFG665C delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact 665-FCBGA surface-mount package. Its specifications make it well suited for designers who need substantial on‑chip resources and a high pin‑count FPGA in a commercial-grade device.

Manufactured by AMD as part of the Virtex®-5 SXT family, the device is RoHS compliant and supported by a published datasheet from the manufacturer for detailed electrical and mechanical information. Its electrical and thermal ratings are suited to commercial electronic product development and deployment.

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