XC5VSX50T-1FF665I
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA |
|---|---|
| Quantity | 895 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-1FF665I – Virtex®-5 SXT FPGA, 665-FCBGA (27×27), Industrial
The XC5VSX50T-1FF665I is a Virtex®-5 SXT field-programmable gate array (FPGA) offering a high logic resource count with 52,224 logic elements and approximately 4.87 Mbits of embedded memory. The device exposes 360 I/Os and operates from a core supply range of 0.95 V to 1.05 V.
Packaged in a 665-FCBGA (27×27) surface-mount package and rated for an operating temperature range of -40 °C to 100 °C, this FPGA is specified for industrial-grade environments and RoHS-compliant manufacturing.
Key Features
- Core Logic 52,224 logic elements provide substantial programmable logic capacity for complex designs.
- Embedded Memory Approximately 4.87 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
- I/O Density 360 I/O pins to support a wide range of external interfaces and parallel connectivity.
- Power Supply Core voltage specified between 0.95 V and 1.05 V, enabling defined power budgeting for system design.
- Package and Mounting 665-FCBGA (27×27) package, surface-mount mounting for compact board integration.
- Temperature Range Industrial operating range from -40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS-compliant for environmentally responsible assembly processes.
Unique Advantages
- High logic capacity: 52,224 logic elements support complex, high-performance logic implementations without immediate need for external logic expansion.
- Significant on-chip memory: Approximately 4.87 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage tasks.
- Broad I/O count: 360 I/Os enable flexible interfacing to peripherals, sensors, and parallel buses.
- Industrial temperature rating: Specified -40 °C to 100 °C operation supports deployment in environments with wide temperature variation.
- Compact, surface-mount FCBGA package: 665-FCBGA (27×27) balances density and board-level integration for space-constrained designs.
- Controlled core power range: 0.95 V to 1.05 V core supply simplifies power supply selection and thermal planning.
Why Choose XC5VSX50T-1FF665I?
The XC5VSX50T-1FF665I provides a balance of high logic density, substantial embedded memory, and extensive I/O in a compact FCBGA package rated for industrial temperatures. It is positioned for designs that require significant on-chip resources and predictable power and thermal characteristics.
Engineers and procurement teams selecting this device gain a RoHS-compliant FPGA platform with clearly defined electrical and environmental specifications, suitable for scalable, robust implementations where on-chip logic and memory density are primary considerations.
Request a quote or submit an inquiry to receive pricing and availability information for the XC5VSX50T-1FF665I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








