XC5VSX50T-1FF665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA

Quantity 895 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-1FF665I – Virtex®-5 SXT FPGA, 665-FCBGA (27×27), Industrial

The XC5VSX50T-1FF665I is a Virtex®-5 SXT field-programmable gate array (FPGA) offering a high logic resource count with 52,224 logic elements and approximately 4.87 Mbits of embedded memory. The device exposes 360 I/Os and operates from a core supply range of 0.95 V to 1.05 V.

Packaged in a 665-FCBGA (27×27) surface-mount package and rated for an operating temperature range of -40 °C to 100 °C, this FPGA is specified for industrial-grade environments and RoHS-compliant manufacturing.

Key Features

  • Core Logic 52,224 logic elements provide substantial programmable logic capacity for complex designs.
  • Embedded Memory Approximately 4.87 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
  • I/O Density 360 I/O pins to support a wide range of external interfaces and parallel connectivity.
  • Power Supply Core voltage specified between 0.95 V and 1.05 V, enabling defined power budgeting for system design.
  • Package and Mounting 665-FCBGA (27×27) package, surface-mount mounting for compact board integration.
  • Temperature Range Industrial operating range from -40 °C to 100 °C for deployment in demanding environments.
  • Compliance RoHS-compliant for environmentally responsible assembly processes.

Unique Advantages

  • High logic capacity: 52,224 logic elements support complex, high-performance logic implementations without immediate need for external logic expansion.
  • Significant on-chip memory: Approximately 4.87 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage tasks.
  • Broad I/O count: 360 I/Os enable flexible interfacing to peripherals, sensors, and parallel buses.
  • Industrial temperature rating: Specified -40 °C to 100 °C operation supports deployment in environments with wide temperature variation.
  • Compact, surface-mount FCBGA package: 665-FCBGA (27×27) balances density and board-level integration for space-constrained designs.
  • Controlled core power range: 0.95 V to 1.05 V core supply simplifies power supply selection and thermal planning.

Why Choose XC5VSX50T-1FF665I?

The XC5VSX50T-1FF665I provides a balance of high logic density, substantial embedded memory, and extensive I/O in a compact FCBGA package rated for industrial temperatures. It is positioned for designs that require significant on-chip resources and predictable power and thermal characteristics.

Engineers and procurement teams selecting this device gain a RoHS-compliant FPGA platform with clearly defined electrical and environmental specifications, suitable for scalable, robust implementations where on-chip logic and memory density are primary considerations.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VSX50T-1FF665I.

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