XC5VSX50T-1FF1136I

IC FPGA 480 I/O 1136FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 480 4866048 52224 1136-BBGA, FCBGA

Quantity 1,705 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O480Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-1FF1136I – Virtex®-5 SXT Field Programmable Gate Array (FPGA)

The XC5VSX50T-1FF1136I is a Virtex‑5 SXT field programmable gate array designed for high-density digital integration. This industrial‑grade, surface‑mount FPGA combines a large logic fabric with multi-megabit embedded memory and a high I/O count to support complex, board‑level designs.

Key on‑device specifications include 52,224 logic elements, approximately 4.86 Mbits of embedded memory, 480 I/Os, a 1136‑FBGA package (1136‑FCBGA, 35×35 mm), a core supply range of 950 mV to 1.05 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

  • Core Virtex‑5 SXT FPGA architecture with 52,224 logic elements for on‑chip digital logic integration.
  • Embedded Memory Approximately 4.86 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
  • I/O Capacity 480 user I/Os to accommodate dense interfacing requirements and multiple peripheral connections.
  • Power Core supply voltage range from 950 mV to 1.05 V to match system power rails and design requirements.
  • Package & Mounting 1136‑FBGA package (listed as 1136‑FCBGA, 35×35 mm); surface mount mounting for high‑density PCB assembly.
  • Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑varied environments.
  • Regulatory RoHS compliant, supporting lead‑free manufacturing processes.

Unique Advantages

  • High logic density: 52,224 logic elements enable substantial on‑chip integration of combinational and sequential logic, reducing the need for external components.
  • Significant embedded memory: Approximately 4.86 Mbits of on‑chip RAM provide local storage and buffering to support data‑intensive functions.
  • Extensive I/O capability: 480 I/Os allow flexible connectivity for multiple interfaces and board‑level integration.
  • Industrial temperature range: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial applications.
  • Compact, assembly‑ready package: 1136‑FBGA (1136‑FCBGA, 35×35 mm) surface‑mount package supports high‑density PCB layouts and automated assembly.
  • RoHS compliance: Supports lead‑free manufacturing and regulatory compliance for many production environments.

Why Choose XC5VSX50T-1FF1136I?

The XC5VSX50T-1FF1136I positions itself as a high‑density Virtex‑5 SXT FPGA for designs requiring substantial logic resources, multi‑megabit embedded memory, and large I/O capability within a surface‑mount 1136‑FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployed systems operating across a wide thermal range.

This device is appropriate for engineering teams and procurement groups seeking a scalable, integration‑focused FPGA solution that consolidates logic, memory, and I/O on a single device while matching specific power and package constraints.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the XC5VSX50T-1FF1136I.

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