XC5VSX50T-1FF1136I
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 480 4866048 52224 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,705 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 480 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 4080 | Number of Logic Elements/Cells | 52224 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4866048 |
Overview of XC5VSX50T-1FF1136I – Virtex®-5 SXT Field Programmable Gate Array (FPGA)
The XC5VSX50T-1FF1136I is a Virtex‑5 SXT field programmable gate array designed for high-density digital integration. This industrial‑grade, surface‑mount FPGA combines a large logic fabric with multi-megabit embedded memory and a high I/O count to support complex, board‑level designs.
Key on‑device specifications include 52,224 logic elements, approximately 4.86 Mbits of embedded memory, 480 I/Os, a 1136‑FBGA package (1136‑FCBGA, 35×35 mm), a core supply range of 950 mV to 1.05 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.
Key Features
- Core Virtex‑5 SXT FPGA architecture with 52,224 logic elements for on‑chip digital logic integration.
- Embedded Memory Approximately 4.86 Mbits of on‑chip RAM to support buffering, state storage, and local data processing.
- I/O Capacity 480 user I/Os to accommodate dense interfacing requirements and multiple peripheral connections.
- Power Core supply voltage range from 950 mV to 1.05 V to match system power rails and design requirements.
- Package & Mounting 1136‑FBGA package (listed as 1136‑FCBGA, 35×35 mm); surface mount mounting for high‑density PCB assembly.
- Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature‑varied environments.
- Regulatory RoHS compliant, supporting lead‑free manufacturing processes.
Unique Advantages
- High logic density: 52,224 logic elements enable substantial on‑chip integration of combinational and sequential logic, reducing the need for external components.
- Significant embedded memory: Approximately 4.86 Mbits of on‑chip RAM provide local storage and buffering to support data‑intensive functions.
- Extensive I/O capability: 480 I/Os allow flexible connectivity for multiple interfaces and board‑level integration.
- Industrial temperature range: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial applications.
- Compact, assembly‑ready package: 1136‑FBGA (1136‑FCBGA, 35×35 mm) surface‑mount package supports high‑density PCB layouts and automated assembly.
- RoHS compliance: Supports lead‑free manufacturing and regulatory compliance for many production environments.
Why Choose XC5VSX50T-1FF1136I?
The XC5VSX50T-1FF1136I positions itself as a high‑density Virtex‑5 SXT FPGA for designs requiring substantial logic resources, multi‑megabit embedded memory, and large I/O capability within a surface‑mount 1136‑FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployed systems operating across a wide thermal range.
This device is appropriate for engineering teams and procurement groups seeking a scalable, integration‑focused FPGA solution that consolidates logic, memory, and I/O on a single device while matching specific power and package constraints.
Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the XC5VSX50T-1FF1136I.

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