XC5VSX35T-3FFG665C

The XC5VSX35T-3FFG665C is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC manufactured by AMD. It delivers a high-density, reconfigurable logic resource with substantial on-chip memory and a large I/O complement for complex digital designs.

With approximately 34,816 logic elements, roughly 3.1 Mbits of embedded memory and 360 I/O pins, this commercial‑grade device is suited to applications that require significant integration of logic, memory and system interfaces within a single surface‑mount FCBGA package.

Key Features

• Core Logic Capacity  Approximately 34,816 logic elements provide a dense fabric for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 3.1 Mbits of on‑chip RAM to support buffering, lookup tables and intermediate data storage without external memory.
• I/O Resources  360 configurable I/O pins to consolidate multiple system interfaces and simplify board‑level routing.
• Package & Mounting  665‑FCBGA (27×27) package in a 665‑BBGA/FCBGA form factor, designed for surface‑mount PCB assembly.
• Power Supply  Core voltage range from 0.95 V to 1.05 V to match target system power domains.
• Operating Range & Grade  Commercial operating temperature range of 0 °C to 85 °C, suitable for typical commercial applications.
• Environmental Compliance  RoHS‑compliant construction.

Typical Applications

• Reconfigurable Prototyping  Rapid hardware validation and prototyping where a large logic resource and flexible I/O are required.
• Logic‑Dense System Integration  Consolidation of multiple digital functions into a single FPGA to reduce board-level component count.
• Memory‑Intensive Processing  On‑chip RAM supports buffering and intermediate storage for packet handling, data aggregation or algorithm staging.
• Interface Aggregation  Use the 360 I/Os to implement multiple peripheral and interface connections within one device footprint.

Unique Advantages

• High logic density: Approximately 34,816 logic elements enable implementation of complex finite state machines, datapaths and custom accelerators.
• Significant embedded memory: Around 3.1 Mbits of on‑chip RAM reduces reliance on external memory for intermediate data storage, simplifying BOM and board layout.
• Large I/O count: 360 I/O pins allow extensive peripheral connectivity and interface consolidation on a single device.
• Compact FCBGA package: 665‑FCBGA (27×27) provides a high‑density package option for space‑constrained boards while supporting surface‑mount assembly.
• Controlled power domain: Core voltage support from 0.95 V to 1.05 V enables integration with modern low‑voltage system power architectures.
• Commercial temperature rating: Rated 0 °C to 85 °C for designs targeting commercial environments.

Why Choose XC5VSX35T-3FFG665C?

The XC5VSX35T-3FFG665C balances a substantial logic fabric, meaningful on‑chip memory and a broad I/O set in a single commercial‑grade FCBGA package. It is well suited for engineers who need to combine multiple digital functions, interface requirements and embedded memory within one reconfigurable device.

Choose this Virtex‑5 SXT FPGA when your design demands tens of thousands of logic elements, several megabits of embedded RAM and hundreds of I/Os packaged for surface‑mount assembly within a commercial operating temperature range.

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