XC5VSX35T-2FFG665C

The XC5VSX35T-2FFG665C is a Virtex-5 SXT Field Programmable Gate Array (FPGA) IC from AMD. It provides programmable logic resources and embedded memory suitable for custom digital implementations.

This device includes 34,816 logic elements and approximately 3.096576 Mbits of embedded memory, together with 360 user I/O pins. Packaged in a 665-FCBGA (27×27) surface-mount package and rated for commercial operation (0 °C to 85 °C), it addresses designs that require significant logic density, on-chip RAM, and high pin-count interfacing while operating from a 0.95 V to 1.05 V supply.

Key Features

• Core Logic  34,816 logic elements for implementing wide-ranging programmable logic functions.
• Embedded Memory  Approximately 3.096576 Mbits of total on-chip RAM bits to support buffering, lookup tables, and data storage within the FPGA fabric.
• High I/O Count  360 user I/O pins to support multiple interfaces, parallel buses, and high-density connectivity.
• Package & Mounting  665-BBGA, FCBGA package in a 27×27 ball-grid footprint; designed for surface-mount assembly.
• Power  Nominal voltage supply range of 0.95 V to 1.05 V for core power.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance  RoHS-compliant construction.

Typical Applications

• High-density programmable logic  Implement complex custom logic functions using the device's 34,816 logic elements.
• Memory-intensive processing  On-chip RAM (approximately 3.10 Mbits) supports buffering, packet handling, and embedded data storage tasks.
• High-pin-count interfacing  360 I/O pins enable integration with multiple parallel or serial interfaces and external peripherals.

Unique Advantages

• High logic capacity: 34,816 logic elements provide ample resources for complex custom designs and parallel implementations.
• Substantial embedded memory: Approximately 3.096576 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O footprint: 360 user I/O pins simplify board-level integration with sensors, interfaces, and I/O-rich subsystems.
• Compact BGA package: 665-FCBGA (27×27) delivers high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial-grade operation: Rated 0 °C to 85 °C to meet standard commercial environment requirements.
• RoHS compliant: Built to meet common environmental compliance expectations.

Why Choose XC5VSX35T-2FFG665C?

The XC5VSX35T-2FFG665C places significant programmable logic, embedded memory, and high I/O capacity into a single Virtex-5 SXT FPGA package from AMD. Its combination of 34,816 logic elements, approximately 3.096576 Mbits of on-chip RAM, and 360 I/O pins makes it well suited to engineers developing designs that need integrated logic density and on-chip data storage within a commercial temperature range.

This device is appropriate for projects that demand a high-pin-count, surface-mount FPGA solution with controlled core-voltage operation (0.95 V–1.05 V). Its packaging and feature set provide a scalable platform for mid- to high-complexity programmable logic designs.

Request a quote or submit a procurement inquiry for the XC5VSX35T-2FFG665C to receive pricing and availability information.