XC5VSX35T-2FFG665I

The XC5VSX35T-2FFG665I is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC from AMD featuring a high logic capacity and on-chip memory in a compact 665-FCBGA (27×27) package. It combines substantial logic resources and embedded RAM with a 360-pin I/O count to address mid-density programmable logic needs.

This device is specified for industrial-grade operation and supports a core voltage range of 950 mV to 1.05 V, with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulated environments.

Key Features

• Logic Capacity  Approximately 34,816 logic elements to implement complex digital designs and custom architectures.
• Embedded Memory  Approximately 3.096 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
• I/O Density  360 I/O pins to accommodate multi-channel interfaces, parallel buses, and high-pin-count peripherals.
• Power and Core Voltage  Operates with a core voltage supply range of 950 mV to 1.05 V to match system power domains.
• Package and Mounting  665-FCBGA (27×27) package in a surface-mount format for compact board-level integration.
• Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance  RoHS compliant, meeting lead-free and restricted-substance requirements for regulated assemblies.

Typical Applications

• Industrial Control and Automation  Leverages industrial temperature rating and high I/O count to implement custom control logic, sensor interfaces, and actuator drive systems.
• Embedded Processing and Signal Handling  Uses large logic capacity and on-chip RAM for custom data-paths, real-time processing, and intermediate buffering.
• High-Density I/O Systems  360 I/Os enable complex interfacing tasks such as multi-channel data acquisition, parallel buses, and high-pin-count peripheral aggregation.

Unique Advantages

• Substantial Logic Resources: Approximately 34,816 logic elements provide the capacity to implement sizable custom hardware functions on a single device.
• Significant On-Chip Memory: Approximately 3.096 Mbits of embedded RAM reduces external memory requirements for many buffering and state-storage needs.
• High I/O Count: 360 I/Os simplify board-level design by accommodating multiple interfaces and parallel connections without external multiplexing.
• Industrial-Grade Operation: Specified −40 °C to 100 °C operation supports deployment in industrial environments with wide temperature ranges.
• Compact Surface-Mount Package: 665-FCBGA (27×27) package enables high-density PCB integration while maintaining thermal and electrical performance.
• RoHS Compliant: Meets lead-free and restricted-substance requirements for modern manufacturing and environmental regulations.

Why Choose XC5VSX35T-2FFG665I?

The XC5VSX35T-2FFG665I positions itself as a balanced, industrial-grade FPGA solution that brings together substantial logic capacity, embedded memory, and a high I/O count in a compact 665-FCBGA surface-mount package. Its supported core voltage range and extended operating temperature make it suitable for designs requiring reliable, mid-density programmable logic in regulated environments.

This device is well suited for engineering teams building industrial controls, embedded processing systems, and high-density I/O applications that need on-chip memory, flexible I/O, and a robust thermal range while maintaining RoHS compliance.

Request a quote or submit an inquiry to discuss availability, pricing, and how the XC5VSX35T-2FFG665I can fit into your next design.